Hon Hai Publishes Environmental Management Manual and Zero-Waste Certificate Map
August 16, 2024 | FoxconnEstimated reading time: 2 minutes
Hon Hai Technology Group continues to promote the concept of “EPS+ESG = sustainable management” and spares no effort. During the ESG theme month “Hon Hai Environment Month”, for the first time, the group’s “Environmental Management Manual” was published to the public. At the same time, it was also officially revealed that the group’s zero-waste certificate map clearly marked the locations of the 24 platinum-level and 3 gold-level UL 2799 zero waste landfill certificates around the world and related legal persons, further enhancing the company’s transparency and integrity and demonstrating the company’s commitments and practices in environmental protection and sustainable development.
Hon Hai officially released the “Environmental Management Manual” internally last year to strengthen compliance with local and international environmental regulations in the factory, enable employees to understand and implement environmental protection measures, and effectively identify and manage environmental risks through open and clear procedures. This not only strengthens the company’s legal and compliant operations and sustainable development foundation but also enhances its overall competitiveness. This year, Hon Hai further published the “Environmental Management Manual” on the company’s official website so that relevant stakeholders and partners can have a clear basis for following it.
Hon Hai’s Yantai campus has now achieved a 100% waste conversion rate, 6% of which is converted into energy, and has officially obtained the “Platinum Level Certification”, the highest level of UL 2799 zero waste to landfill. This is the fifth park of Hon Hai to obtain this certification since 2022, achieving the long-term environmental goal of 2025 ahead of schedule.
“Zero landfill” is one of Hon Hai’s key strategies to build a green recycling park. It gradually reduces the incineration of waste by reducing the use of raw materials at the source, increasing the recycling and reuse of internal and external packaging materials, etc., and implementing multiple green environmental protection and reduction projects and landfill to achieve the standards of 100% waste conversion rate and no more than 10% incineration heat recovery. At the same time, Hon Hai controls the waste at the end, conducts real-time tracking through its self-developed management system, and conducts regular inspections of outsourced manufacturers to ensure that they handle waste legally.
Hon Hai is actively moving towards the goal of a comprehensive zero-waste park, and through internal sharing and exchange training meetings, it is extending the experience of mainland factories to overseas factories, including Mexico, Brazil, Vietnam, India, and the Czech Republic. As of July 2024, Hon Hai Group has obtained 24 platinum-level and 3 gold-level UL 2799 zero waste landfill certificates, covering a total of 47 companies including Foxconn Industrial Internet Co., Ltd., Hongteng Precision Technology, and FIZH Group Co., Ltd. Legal person certification completed. These achievements demonstrate Hon Hai’s environmental protection practices and continuous improvement in waste management and resource reuse, and continue to mitigate the impact of environmental pollution and ecological damage during operations.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.
TRI Launches New Wafer Inspection and Metrology Platform
04/28/2026 | TRITest Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series.