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New Database of Materials Accelerates Electronics Innovation

05/05/2025 | ACN Newswire
In a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.

New Database of Materials Accelerates Electronics Innovation

05/02/2025 | ACN Newswire
In a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.

BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

Nolan's Notes: The Next Killer App in Component Manufacturing

05/02/2025 | Nolan Johnson -- Column: Nolan's Notes
For quite a while, I’ve been wondering what the next “killer app” will be in electronics manufacturing and why it has been so long since the last disruptive change in EMS. I believe the answer lies in artificial intelligence, which has exploded as the next disruptor.

Teledyne Appoints George Bobb as Chief Executive Officer

05/01/2025 | BUSINESS WIRE
Teledyne Technologies Incorporated announced that Teledyne’s Board of Directors named George C. Bobb III as Teledyne’s President and Chief Executive Officer, effective immediately. Simultaneously, Edwin Roks has retired as Teledyne’s Chief Executive Officer, but will continue as a special advisor to Robert Mehrabian, Executive Chairman, through August 31, 2025.
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