-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
U.S. Navy Awards SAIC Three Contracts for Engineering Services
August 16, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Science Applications International Corp. has been awarded three contracts worth $58.2M to support the Airborne Electronic Attack (AEA) Integrated Product Team (IPT) Jammer Technique Optimization (JATO) Program, the International Program, and the AEA IPT EA-18G Program.
“These three contracts are a testament to SAIC’s reputation of delivering mission-critical solutions and dedicated support to the Naval Air Warfare Center Weapons Division, Point Mugu,” said Barbara Supplee, executive vice president, Navy Business Group at SAIC. “This work goes beyond technical services. We are contributing to the sustainment of engineering services as well as airborne jammer optimization and effectiveness data collection and reporting for the Navy.”
Under the JATO contract, SAIC will deliver a wide range of technical services including jammer technique development, test and evaluation engineering, interoperability testing and analysis, threat analysis, tactics development, mission data development and production and Fleet liaison activities. This work will play a crucial role in optimizing jamming techniques, enhancing the effectiveness of Electronic Warfare (EW) platforms and systems and ensuring the readiness of the EA-18G aircraft and other EW assets.
Under the AEA IPT International contract, SAIC will continue to provide support to the international service project by performing maintenance of existing AEA simulations and development of tools and new simulations. SAIC will also perform the engineering, technical and policy support services for the international program teams, supporting Foreign Military Sales (FMS), Cooperative Development and other relationship programs for the Electronic Attack (EA) and Electronic Warfare products.
Additional support to AEA IPT includes engineering services for the development and sustainment efforts of both the United States Navy (USN) and Foreign Military Sales (FMS) configurations of the EA-18G. Engineering services will include cooperative and collaborative engineering support to other laboratories and will include general management, engineering support, product support and systems engineering, integration, and test for the EA-18G team.
Suggested Items
GlobalFoundries, U.S. Department of Commerce Announce Award Agreement on CHIPS Act Funding for Essential Chip Manufacturing
11/22/2024 | GlobalFoundriesGlobalFoundries (GF) and the U.S. Department of Commerce have announced an award of up to $1.5 billion in direct funding to GF through the CHIPS and Science Act.
L3Harris Achieves UK Defence Employer Recognition Award
11/21/2024 | L3Harris TechnologiesL3Harris Technologies has achieved Silver Award status in the U.K.’s Defence Employer Recognition Scheme, a coveted acknowledgement of the company’s commitment to and support for the Armed Forces community, aligned to the values of the country’s Armed Forces Covenant.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
IBM Expands its AI Accelerator Offerings; Announces Collaboration with AMD
11/18/2024 | IBMIBM and AMD have announced a collaboration to deploy AMD Instinct MI300X accelerators as a service on IBM Cloud. This offering, which is expected to be available in the first half of 2025, aims to enhance performance and power efficiency for Gen AI models such as and high-performance computing (HPC) applications for enterprise clients.
DuPont and Habitat for Humanity International Continue Global Partnership
11/18/2024 | PRNewswireHabitat for Humanity International and DuPont today announced they are renewing their annual global partnership. As part of the collaboration,