It’s Only Common Sense: You Can’t Please Everyone—Focus on the Right Customers
Marcy’s Musings: Fueling the Workforce Pipeline
The Chemical Connection: Better Fabs Attract a Better Workforce
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at NEPCON Vietnam
August 20, 2024 | AIMEstimated reading time: Less than a minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming NEPCON Vietnam taking place September 11-13 at I.C.E. Hanoi, Vietnam. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at NEPCON Vietnam September 11-13th at booth U05.
Share on:
Suggested Items
SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.
Connect the Dots: Designing for Reality—Surface Finish
01/29/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the solder mask and legend process, one of the final steps in the PCB manufacturing process. The board is nearly complete. We just need to wrap up production by applying a surface finish to protect the copper from oxidation and facilitate soldering components onto the board.
AIM Solder Promotes Kelly Cardone to Vice President, Customer Experience
01/21/2025 | AIMAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the promotion of Kelly Cardone to Vice President, Customer Experience. This promotion highlights AIM’s commitment to offering superior support and customer experience.
Indium to Showcase Durafuse Solder Technology at NEPCON Japan
01/21/2025 | Indium CorporationAs one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
01/17/2025 | PetersPeters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).