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Altium, IPC Education Foundation, and Arduino Announce Student Electronics Design Competition

08/17/2022 | Altium LLC
Altium LLC, the leading printed circuit board (PCB) design software company, is partnering with the IPC Education Foundation (IPCEF) and Arduino to launch the second annual student electronics design challenge. This competition aims to engage, educate, and enhance PCB design capabilities while developing STEM solutions to environmental challenges. The electronics design challenge is an excellent opportunity for students to showcase their talents and gain real-world experience.

Altium, IPC Education Foundation, and Arduino Announce Student Electronics Design Competition

08/17/2021 | Altium Limited
Altium LLC, the leading printed circuit board (PCB) software company, is partnering with the IPC Education Foundation (IPCEF) and Arduino to launch the first student electronics design challenge to engage, educate, and enhance printed circuit board (PCB) design capabilities while developing STEM solutions to environmental challenges.

Powerful Prototypes: Small Computer Modules

11/11/2020 | Duane Benson -- Column: Powerful Prototypes
Duane Benson has taken a rather long hiatus from building things—probably the longest in recent memory. For this column, he half-steps back into the design world by looking at a product someone else designed and built—the µduino (micro-duino).

Bob Martin Brings Maker Attitude to AltiumLive Keynote

10/07/2019 | Andy Shaughnessy, Design007 Magazine
Bob Martin is a self-proclaimed “Wizard of Make” and senior staff engineer with Microchip Technology. Next week, this leader of the maker community will be one of the keynote speakers at AltiumLive in San Diego, California. I caught up with Bob and asked him to give us a preview of his presentation.

NextFlex Project Offers Opportunity to Broaden Awareness of FHE

02/12/2018 | NextFlex
As part of the Flexible Arduino Microcontroller Project, NextFlex redesigned a device typically built on a rigid printed circuit board (PCB)—by printing and attaching thin bare die on a flexible substrate while maintaining the performance associated with traditional packaged ICs.
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