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Unlocking Advanced Circuitry Through Liquid Metal Ink

10/31/2024 | I-Connect007 Editorial Team
PCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.

Connect the Dots: Designing for Reality—Pattern Plating

10/16/2024 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.

AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum

08/30/2024 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia.

AIM to Highlight H10 Halogen Free Solder Paste at Productronica India

08/21/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica India taking place September 11-13 at India Exposition Mart Limited (IEML), Greater Noida, Delhi.

Real Time with… THECA 2024: State of the Art Copper Adhesion

08/09/2024 | Real Time with... THECA
Bruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts.
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