Universal Instruments Joins Parent Company Delta to Highlight Comprehensive Semiconductor Solutions at SEMICON Taiwan
August 30, 2024 | Universal InstrumentsEstimated reading time: 1 minute

Universal Instruments will join parent company Delta, a global leader in power and thermal management technologies and a world-class provider of industrial automation solutions, on booth S7542 at the SEMICON Taiwan trade show on September 4–6. The booth will feature a seamless integration of semiconductor solutions, including Delta’s Wafer Edge Profile Measurement Machine for front-end processing and Universal’s FuzionSC™ and High-Speed Wafer Feeder back-end multi-die placement solution. Delta will also showcase its Digital-Twin (DlA-Twin) simulation software and adoption of the SEMI E187 cybersecurity practices, surpassing current industry standards.
The Wafer Edge Profile Measurement Machine measures the notch, flat length and edge shape of the ground wafer while also detecting wafer quality and defects. It employs non-destructive AOI optical technology to take these measurements with micro-scale repeatability, which achieves a high throughput of approximately 60-120 wafers per hour. The system supports automated robotic loading/unloading and AGV transport systems, combining diverse functions into a single machine. Delta also offers additional front-end processing solutions including Wafer Edge Grinding, Sorting and IR Pinhole Inspection.
DIATwin is an intelligent design and development tool that can precisely simulate loading points and paths in a virtual environment, enabling the evaluation of production cycle times and reducing the trial-and-error costs in new product introduction. Integrating the DIATwin Virtual Machine Development Platform with front-end equipment to create virtual environments greatly improves efficiency of new product introductions.
The FuzionSC Platform combined with the HSWF is the ultimate solution for challenging multi-die package applications. It’s capable of placing passives and multiple die types in a single cell, eliminating the need to move product between cells and maximizing accuracy and efficiency.
Universal Instruments Vice President of Global Customer Operations and Corporate Marketing, Glenn Farris stated, “The complementary semiconductor solutions we’re able to offer put our customers at the forefront of this fast-moving target. Tying front-end and back-end equipment and processes together, leveraging AI and digital twin technologies to streamline NPI and production, and protecting assets with advanced cybersecurity are all integral advantages.”
Along with visiting the booth, Universal encourages attendees to join a technical presentation by Universal Instruments VP of Global Customer Operations and Corporate Marketing, Glenn Farris. On Friday, September 6 at 11:20 am CST at the HITECH Smart Manufacturing Forum he will present “Accelerating Innovation: Smart Manufacturing for Advanced Semiconductor Packaging”.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.
Toshiba, SICC Sign MOU on Collaboration in SiC Power
08/28/2025 | ToshibaThe two companies will discuss the scope of their joint efforts and mutual support.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.