It’s Only Common Sense: Motivate Your Team by Giving Them What They Crave
Happy’s Tech Talk #33: Wet Process Management and Control
Dan’s Biz Bookshelf: ‘From Bud to Boss: Secrets to a Successful Transition to Remarkable Leadership’AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
August 30, 2024 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
In addition, AIM Technical Sales Manager for Southeast Asia, Mhanny Aguillo will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:
High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue. Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.
Share on:
Suggested Items
Nortech Systems Announces Expansion of PCBA Capabilities with IPC-J-STD-001 Space Addendum
10/08/2024 | BUSINESS WIRENortech Systems Incorporated (“Nortech Systems”, or the “Company), a leading provider of engineering and manufacturing solutions for the aerospace and defense industry, has announced the Company has certified trainers and operators to build printed circuit board assemblies (PCBAs) to the IPC-J-STD-001 Space Addendum standard.
Absolute EMS Expands Capabilities to Support the AI Industry with High-Complexity, High-Reliability PCB Assembly Services
10/08/2024 | Absolute EMS, Inc.Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence
NEOTech Announces Implementation of Enhanced Wire Bonding Process to Boost Microelectronics Manufacturing Efficiency
10/08/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies.
KYZEN to Spotlight Solvent Solutions for Medical Device Cleaning at MD&M Minneapolis
10/04/2024 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at MD&M Minneapolis 2024, scheduled to take place Oct. 16-17, 2024 at the Minneapolis Convention Center.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.