American Made Advocacy: There's No Substitute for American-made Microelectronics
It’s Only Common Sense: When Will Big Companies Start Paying Their Bills on Time?
The Chemical Connection: Troubleshooting PCB Process Problems
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Penang Expo & Tech Forum
August 30, 2024 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Penang Expo & Tech Forum taking place September 25-26 at AC Hotel Penang in Malaysia. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
In addition, AIM Technical Sales Manager for Southeast Asia, Mhanny Aguillo will be giving a presentation titled High Reliability: The Challenges of Soldering for Extremely Harsh Environments:
High reliability in electronics pertains to the quality of solder joints themselves as well as the electrochemical properties of the flux residue. Key characteristics of reliable solder joints include strength and ductility. These joints are often tested via thermal cycling, drop shock and more. Exact testing requirements are dependent on application. When it comes to flux, industry standards such as IPC and JIS define the electrochemical requirements of flux residues, which is particularly important in no clean processes. This presentation outlines the trends and challenges of high reliability application sin automotive, military & aerospace, and LED sectors. Test data comparing specially formulated high reliability alloys with SAC305 are presented along with a discussion of how key elements of the alloys aid in improved reliability.
Share on:
Suggested Items
Absolute EMS Earns ITAR Registration
10/31/2024 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), proudly announces its ITAR (International Traffic in Arms Regulations) registration, reinforcing its commitment to serving military, aerospace and defense OEM customers.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Spirit Electronics Adds Zero-Error Systems to Provide Ultra-High Reliability Protection from Radiation in Space Applications
10/25/2024 | Spirit ElectronicsSpirit Electronics announces franchised distribution for Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
10/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
Indium Experts to Present at International Electronics Manufacturing Technology Conference
10/15/2024 | Indium CorporationIndium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia.