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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Suggested Items

HDP Welcomes Nittobo as New Member

10/21/2026 | HDP User Group
High Density Packaging User Group (HDP) is pleased to announce that Nittobo has become a member.

TechPoint Acquires Esprit Electronics to Expand UK Electronics Manufacturing

10/21/2026 | TechPoint
TechPoint has acquired Esprit Electronics, an electronics manufacturing services (EMS) provider based in Southampton. Esprit Electronics’ team of 92 people joins the TechPoint Group, bringing more than 40 years of experience and deep EMS expertise.

Zhen Ding, NCU Launch Advanced PCB Talent Development Program

10/21/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, the world's leading PCB manufacturer, announced that it has partnered with National Central University (NCU) and three industry partners, including Elite Material, Ta Liang Technology, and Topoint Technology, to establish the “Advanced PCB Talent Development Program.”

Optimizing the Interconnect with Dr. John T.C. Lee

10/21/2026 | Marcy LaRont, I-Connect007 Magazine
When Dr. John T.C. Lee talks about the evolution of electronics, he keeps coming back to the interconnect. As CEO and President of MKS Inc., he saw growing complexity in the connections between increasingly powerful devices as both a manufacturing challenge and a business opportunity. That thinking helped drive MKS’ acquisition of Atotech in 2022, bringing process chemistry and electroplating together with MKS’ existing strengths in lasers, optics, and precision motion, and giving substance to a strategy the company calls Optimize the Interconnect™.

SMTA Renames Event as Microelectronics Packaging & Integration Symposium

10/20/2026 | SMTA
TA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium.
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