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Bassel Haddad Assumes Leadership of ASMPT as Group Chief Executive Officer

08/11/2026 | ASMPT
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Advanced Chip Packaging Technologies Market to Reach $87.6 Billion by 2030

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Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.
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