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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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IBM, Lockheed Martin Launch Quantum Innovation Hub at ETH Zurich

09/13/2026 | Lockheed Martin
IBM and Lockheed Martin, through an offset agreement with armasuisse, Switzerland's Federal Office for Defence Procurement, established a hub for quantum innovation at ETH Zurich, a prominent public research university.

Boeing, GM Complete Sale of HRL Laboratories to IBM

09/01/2026 | Boeing
Boeing and GM announced that the companies have completed the sale of HRL Laboratories, LLC, which was a 50/50 joint venture between Boeing and GM, to IBM. Financial details of the transaction were not disclosed.

IBM Completes Acquisition of HRL Laboratories to Accelerate the Future of Quantum

08/26/2026 | IBM
IBM announced it has completed its acquisition of HRL Laboratories, LLC (HRL), a leading research and development institution whose expertise spans quantum computing, quantum sensing, advanced communications, electronics, manufacturing, and materials science.

IBM, Together AI Partner to Scale Open-Source AI Inference on IBM Cloud

08/14/2026 | IBM
IBM announced a collaboration with Together AI to deliver IBM and NVIDIA AI infrastructure. Under a multi-year $240M agreement between IBM and Together AI, IBM is positioned to deploy a large cluster of NVIDIA HGX B300 systems on IBM Cloud with expected availability in Q1 2027.

IBM, Visionbay.ai to Accelerate the Next Era of AI Across Asia Pacific

07/29/2026 | Foxconn
IBM and Visionbay.ai – backed by Hon Hai Technology Group (Foxconn) — announced a collaboration to develop an AI platform and expand Visionbay’s AI App Store for enterprises and regulated industries across Asia Pacific.
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