Flexible Thinking: Integrated Passive Devices—Design Solutions With Many Benefits
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsEagle Circuits Joins Effort to Transform U.S. Electronics Manufacturing
September 3, 2024 | Eagle CircuitsEstimated reading time: 1 minute
As part of an effort to demonstrate Occam’s superiority over conventional assemblies, Eagle Circuits of Dallas, Texas, has been selected to build the first set of Occam test assemblies. These assemblies will be subjected to a battery of reliability and environmental tests in order to establish Occam’s viability and superiority over incumbent methodologies. This project is being funded by the DOD Executive Agent in cooperation with the Naval Surface Warfare Center, Crane.
“Occam component assemblies provide a giant leap forward for U.S. manufacturing,” said Ray Rasmussen, Occam managing partner. “Using existing equipment, fabricators and their EMS partners are able to construct Occam assemblies today. Once companies give Occam a spin, they will begin to see the possibilities.” Eagle CEO Nilesh Naik added, “In going through this process we began to see, what Ray calls the Occam Opportunity for Eagle and the industry. The possibilities are almost endless. Instead of driving the industry to more and more complex configurations, Occam simplifies the process, allowing us to do much more with a lot less.”
Occam’s solderless methodology lowers cost while greatly improving reliability. Occam addresses many of the stated concerns from DOD regarding the reliability of electronic assemblies as well as a world-leading path forward for the domestic industry. Occam is home-grown, U.S. based, highly reliable, with thermal management, EMI/ESD, security built in. Occam greatly reduces the need for UHDI giving the industry a pathway to achieve world leading performance without the complexity.
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