Flexible Thinking: Rules of Thumb—A Word to the Wise
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBs
AIM to Present on Ultra-Miniature Assembly for Mini/MicroLEDs at MicroLED Connect
September 3, 2024 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming MicroLED Connect Conference and Exhibition taking place September 25-26 in the Conference Center at High Tech Campus Eindhoven in The Netherlands.
AIM’s Director of Product Management, Timothy O’Neill, will be giving a presentation titled Addressing Concerns of Ultra-Miniature Assembly for Mini/MicroLEDs:
The rapid implementation of Mini and MicroLED lighting technologies has promoted innovation in every aspect of the SMT assembly process. Printing, placement, and reflow are all impacted when these assemblies are performed. The main challenge posed by this type of assembly is simply the scale of the components. The dimensions involved are below the visual threshold for most human beings. One of the biggest challenges for assembly in this sector involves the printing of solder paste. Tens, if not hundreds of thousands of ultra-miniature deposits must be made with micron precision in a single stroke of a squeegee. Furthermore, his needs to be accomplished at production speed and scale without room for error. In this presentation, we share our knowledge and solutions acquired as one of the largest solder suppliers in the world to the Mini and MicroLED market.
Mr. O’Neill will give his presentation during MicroLED Connect on September 26th at 12:20pm.
Share on:
Suggested Items
Flex Factory Recognized for Manufacturing Excellence and Continuous Improvement by the Association for Manufacturing Excellence
12/19/2024 | FlexFlex announced that its Zhuhai, China site, specializing in advanced assembly, tool design and manufacturing, and metal and plastics capabilities for Lifestyle and Data Center customers, received an Excellence Award from the Association for Manufacturing Excellence (AME) for demonstrating world-class continuous improvement and results. This is the third consecutive year a Flex facility received an AME Excellence Award.
Mycronic Introduces New Machine Models to Its High-Performance Pick-And-Place Platform MYPRO A40
12/06/2024 | MycronicMycronic, the leading Sweden-based electronics assembly solutions provider, is introducing two new machine models MYPro A40SX and A40LX to its next-generation MYPro A40 pick-and-place platform, equipped with the all-new MX7 high-speed mounthead technology.
IPC Announces Two New Courses to Enhance Electronics Manufacturing Excellence
12/03/2024 | IPCIPC is excited to announce the launch of two new courses designed to optimize electronics manufacturing processes: "Ensuring Excellence: IPC-J-STD-001 Process Optimization" and "Ensuring Excellence: IPC-A-610 Process Optimization."
Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities
11/27/2024 | PTEC SolutionsAbsolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is excited to announce a new partnership with PTEC Solutions, a highly respected provider specializing in design, cable and mechanical assembly services.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.