Young Professionals Spotlight: Process Engineer Kevin Dial, American Standard Circuits
September 5, 2024 | Dan Beaulieu, D.B. Management GroupEstimated reading time: 2 minutes
When I heard that my friends at American Standard Circuits had hired a new, fresh-out-of-college process engineer, I was anxious to meet him. Now, you get to read this interview. It’s a rare perspective of a young man new to our industry.
Dan Beaulieu: Kevin, tell me about your journey to America Standard, and what is your position now with ASC?
Kevin Dial: I joined ASC as a wet process engineer in the summer of 2022 after graduating from the University of Iowa. It’s hard to believe two years flew by that quickly, but here we are.
Beaulieu: You’re becoming a veteran by now. What are your daily responsibilities?
Dial: My biggest focus is on circuit formation steps, including imaging, via plating, and etching. Then, I monitor results through AOI and ET. It is a wide-ranging mandate where I can design controls for critical processes and investigate fascinating chemistry. The process engineering team is also putting a lot of effort into refining our registration control scheme from post-etch punch to primary drill tooling. Our exotic material sets often demand that we dig deep into the first principles of a challenge and deploy engineering tools in thoughtful, unique ways. The job generally boils down to constructing flexible, resource-efficient processes that execute our diverse, high-technology product mix.
Beaulieu: What is your background?
Dial: I am a trained chemical engineer with a minor in business administration. The curriculum balanced my interests in industrial process design, undergraduate electrochemical research, and the fundamentals of business organizations. My undergraduate thesis project was a modular gas-to-liquids hydrocarbon synthesis unit that could be transported between decommissioned oil wells to capture methane into useful products. It won a national student team design competition, one of my proudest professional achievements.
Beaulieu: What drew you to ASC?
Dial: As a problem solver, growth only happens outside one’s comfort zone. Three years ago, I couldn’t pick a PCB out of a police lineup, but I was intrigued by all the unfamiliar chemical processes. I figured I could use my background in electroplating as a launch point into the electro-, photo-, and thermal chemistry I didn’t know. I also saw a tight-knit, experienced engineering team that could support my inquiries. The first couple of months were like drinking out a firehose and probably the most educational experience of my life.
Beaulieu: Were you drawn at all by the technology?
Dial: Yes, 100%. Learning PCBs was one thing, but learning our technology set is entirely different. Understanding the unique challenges of running such a diverse set of thermal management solutions, RF/microwave designs, mixed-material builds, embedded passive components, and HDI features is a continuous process that keeps me excited to come to work every day. Every panel is an engineering marvel.
To read this entire conversation, which appeared in the August 2024 issue of PCB007 Magazine, click here.
Suggested Items
Root-cause Analysis and Problem-solving
11/01/2024 | Happy Holden, I-Connect007An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
ESCATEC Pushes New Boundaries in Micro-electronics with UV Enhanced Die Bonder Technology
10/30/2024 | ESCATECElectronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
Real Time with... SMTAI 2024: KYZEN's Process Control System and the Digital Factory
10/30/2024 | Real Time with...SMTAINolan Johnson speaks with Tom Forsythe From KYZEN in this interview captured at SMTA International 2024. Did you know that KYZEN products include more than just cleaning formulas? In this conversation, Tom Forsythe explains how their process control system plays an important role in implementing a digital factory.
DENSO, U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
10/29/2024 | JCN NewswireDENSO CORPORATION and Quadric.inc have signed a development license agreement for a Neural Processing Unit (NPU)(1), which is a semiconductor specialized for the arithmetic processing of AI.