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Advanced Electronics Packaging Digest

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Zhen Ding Technology Reports August 2026 Monthly Revenue

09/08/2026 | Zhen Ding Technology
Zhen Ding Technology Holding Limited, a global leading PCB manufacturer, reported August 2026 revenue of NT$20,666 million, up 41.05% YoY and 17.42% MoM, again setting a record high for the same period in the company’s history.

Powering the Future: From Substrate to System—The Power Module Assembly

08/19/2026 | Brian Buyea -- Column: Powering the Future
If you ask 10 engineers what “assembly” means in electronics, you’ll likely get 10 variations of the same answer: placing components on a board and soldering them down. That definition might work for traditional PCB-based electronics, but in high-power, high-reliability systems, it falls short by a mile.

Semtech to Sell Cellular Module Business to Compal Electronics

08/13/2026 | BUSINESS WIRE
Semtech Corporation, a leading provider of high-performance semiconductors powering AI data center networking, Internet of Things (IoT) and cellular connectivity and intelligent connected devices worldwide, announced that it has entered into a definitive agreement to sell its cellular module business to Compal Electronics, Inc. for $62 million in cash, subject to customary adjustments.

ESCATEC Expands Advanced SMT Capabilities in the UK

08/03/2026 | ESCATEC
ESCATEC has strengthened its surface-mount technology (SMT) capabilities in the UK with the addition of two new ASMPT SX pick-and-place modules at ESCATEC Mechatronics Ltd (EUK) in Lutterworth.

LG Innotek Partners with TDK to Develop Solutions for Physical AI

07/28/2026 | PRNewswire
LG Innotek announced that the company has aligned on a strategic partnership in the field of physical AI with TDK Corporation, a global electronics company (President and CEO Noboru Saito).
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