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Fueling the Workforce Pipeline: January PCB007 Magazine

01/22/2025 | I-Connect007 Editorial Team
Workforce is a topic of conversation in manufacturing businesses that occurs nearly as often today as discussing quality and reliability. In this issue of PCB007 Magazine, we look at fueling the workforce pipeline, specifically at the early introduction of manufacturing to young people. It’s a unique, somewhat unconventional, and long-term perspective aimed at filling the skilled labor gap.

The Promising Future for CEE PCB in Thailand

01/22/2025 | Nolan Johnson, SMT007 Magazine
Tom Yang, CEO of CEE PCB, understands the importance of collaboration between U.S. and Chinese fabricators. He believes that to understand the current political and economic conditions between the two countries, we must maintain a level of international business cooperation. In this interview, we discuss market conditions under a new U.S. administration, how companies like CEE are responding to potential changes, and CEE’s strategic move into Thailand.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

The Pulse: Ultra Upgrade Unknowns—What’s Coming for UHDI?

01/21/2025 | Martyn Gaudion -- Column: The Pulse
As we enter the second quarter of the 21st century, there appears to be a new chapter in PCB technology. Ultra high density interconnect (UHDI) has become a buzzword, but it’s actually not that new; many of the processes were already established in the high-volume production of Asian cell phones and tablets. What is new and challenging, however, is migrating the line widths and stackups—once the domain of handheld consumer products—into the lower volume specialized environment of the commercial world.

Technica USA and Renex Reach Agreement to Distibute REECO Brand of Products

01/21/2025 | Technica USA
Technica is pleased to announce that we have entered into an exclusive distribution agreement with Renex for the REECO brand of ESD and cleanroom products. Technica will distribute the REECO products in the territories of California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, as well as Washington and Utah (non-exclusively).
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