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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

11/15/2024 | Marcy LaRont, I-Connect007
We have quite a mix in this week’s must-reads. The November issue of Design007 Magazine was published, and you don’t want to miss Andy Shaughnessy’s column. This week, we also have a discussion of long-flex PCBs with CEE PCB’s Jerome Larez, and we revisit my forward-looking interview with Dr. Evelyne Parmentier of Dyconex. Jim Will gives us an update on the many things that have transpired in his first five months as executive director at USPAE. Finally, Happy Holden’s next installment of Happy’s Tech Talk looks into the weaknesses of CAD drawings by using a famous Escher print as an example. Happy is definitely one of a kind.

Occam Strengthens Leadership Team with Addition of PCB Expert Dana Korf

11/14/2024 | The Occam Group
The Occam Group, developers of an innovative advanced electronics manufacturing methodology announced the addition of Dana Korf (Korf Consultancy) to its leadership team. Korf, a seasoned PCB professional, will play a pivotal role in driving innovation and expanding Occam’s capabilities for the electronics industry.

NetVia Group Invests in KLA's Frontline InCAM Pro Software

11/14/2024 | Epec
NetVia Group, a leading provider of advanced printed circuit boards (PCBs) and solutions for high-reliability industries, proudly announces its investment in and implementation of Frontline InCAM® Pro software.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2

11/14/2024 | I-Connect007 Editorial Team
The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.

International Electronics Circuit Exhibition (Shenzhen) Coming Dec. 4–6

11/14/2024 | Edy Yu, I-Connect007
HKPCA hosts the 22nd annual International Electronics Circuit Exhibition (Shenzhen) (HKPCA Show), Dec. 4-6, at the Shenzhen International Convention and Exhibition Center (Bao’an) in Halls 5, 6, 7, and 8. With more than 600 global brands and emerging companies, it is one of the world's largest gatherings for the circuit board and electronic assembly industry. The theme of the event is "AI Powers the Future." It will focus on AI, high-end PCBs, high-performance materials, smart automation, and other hot topics. It will showcase innovative processes and technologies across the PCB and PCBA industry chain, bringing together global elites and resources to drive ongoing development.
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