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Spotlight on PEDC: Filbert Arzola 

12/19/2024 | Andy Shaughnessy, Design007 Magazine
IPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.

STARTEAM GLOBAL Earns Silver EcoVadis Score

12/19/2024 | STARTEAM GLOBAL
STARTEAM GLOBAL is thrilled to announce they have earned a silver medal for their EcoVadis score this year — an incredible achievement!

Foxconn Honored with Seven TAISE Sustainability Awards

12/17/2024 | Hon Hai Technology Group
Hon Hai Technology Group (Foxconn), a global technology leader, has been recognized with seven prestigious awards from the Taiwan Sustainable Energy Research Foundation (TAISE) Sustainability Series. This recognition underscores the company’s commitment to environmental sustainability and social responsibility.

Scanfil Suzhou Factory Receives Sustainability Award from Thermo Fisher Scientific

12/16/2024 | Scanfil
Thermo Fisher Scientific granted a Sustainability Award to Scanfil’s Suzhou factory at the APAC Sustainability Summit. This accolade highlights Suzhou’s dedication to sustainable practices.

IPC Launches Comprehensive White Paper on Double Materiality Assessments

12/12/2024 | IPC
IPC has released its latest white paper, Why Double Materiality Assessments Matter: Compliance and Competitive Advantage. This publication offers a roadmap for companies in the electronics industry to navigate the European Union’s Corporate Sustainability Reporting Directive (CSRD) and leverage double materiality assessments (DMAs) for sustainable growth and competitive differentiation.
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