A Parametric Approach to the Environmental Impact of PCB Fabrication

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Sustainability for electronics is receiving more attention due to environmental concerns, regulatory obligations, and to ensure competitiveness in a growing market for sustainable products. To facilitate the discussion on the environmental impact of electronics, there is a strong need for data on energy use, carbon footprint, greenhouse gas (GHG) emissions, hazardous chemicals used during manufacturing, waste generation, etc. 

Hundreds of millions of different part numbers of electronic components are used in the electronics industry today on custom designed substrates using hundreds of different types of laminates and other types of substrate base materials. Electronic components are manufactured using numerous distinctive technologies, processes and materials. To assess the environmental impact of these components and their manufacturing processes, a truthful and universally accepted methodology is needed in order to gain acceptance of the results and to stimulate improvement actions.

Lifecycle assessment (LCA) is a globally accepted and standardized methodology for determining the environmental impact of a product or manufacturing process. The methodology consists of four parts: goal and scope definition, lifecycle inventory (LCI), lifecycle impact assessment (LCIA), and interpretation. The LCA is structured around a functional unit. It defines what is studied and determines product boundaries and the respective inputs and outputs. The potential environmental impacts of the complete product’s lifecycle from raw material acquisition through production, use, end-of-life treatment, recycling and final disposal, is covered in a so-called cradle-to-grave LCA. In some cases, the production phase is considered the most critical or relevant, as this is often the phase the producer has the most influence on. This is called a cradle-to-gate LCA and is quite common in the case of electronics. This paper focuses on the lifecycle inventory or data collection aspect of LCA.

To read this entire article, which appeared in the August 2024 issue of PCB007 Magazine, click here.