Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

Magnachip Semiconductor Announces YJ Kim to Step Down as CEO; Current Board Chairman Camillo Martino Appointed Interim CEO

08/14/2025 | PR Newswire
Magnachip Semiconductor Corporation today announced that YJ Kim has agreed to step down as CEO and as a member of the Board of Directors, effective immediately. Camillo Martino, Chairman of the Board of Directors, has also been appointed Interim Chief Executive Officer, effective immediately.

Dan’s Biz Bookshelf ‘House of Huawei'

08/14/2025 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
Eva Dou’s "House of Huawei" is one of the most gripping business books I’ve read in years, and believe me, I’ve read my fair share. This is not just another corporate biography. It’s a geopolitical thriller, except every word is true. People have painted the Chinese tech giant Huawei as a villain, a threat, and an enigma in equal measure. However, Dou cuts through the noise and delivers something few Western reporters have managed: a fair, balanced, and thoroughly researched look at the company everyone in tech has an opinion about, but few understand.

Foxconn Research Institute, National Yang-Ming Chiao Tung University Jointly Create a New Era of Spatial Computing

08/08/2025 | Foxconn
This technological breakthrough was achieved by Director Guo Haozhong of the Semiconductor Division of Hon Hai Research Institute and Chair Professor at National Yang-Ming National Chiao Tung University, in collaboration with Group Leader Hong Yuheng, Researcher Xu Yezheng, and Researcher Miao Wenqian of the Semiconductor Division, and a research team led by Assistant Professor Huang Yaowei of National Yang-Ming National Chiao Tung University.

ASMPT Introduces MEGA Multi-chip Bonding Platform

08/06/2025 | ASMPT
ASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.

Siemens Transforms Customer Engagement for Electronic Component Manufacturers with PartQuest Design Enablement

08/06/2025 | Siemens
Siemens Digital Industries Software today announced the launch of the PartQuest™ Design Enablement portfolio, a new, connected digital environment for electronic component manufacturers looking to scale smarter, more personalized and persistent engagement with their customers and prospects.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in