Smartkem, Chip Foundation Partner on MicroLED Backlight Tech
September 10, 2024 | PRNewswireEstimated reading time: 1 minute
Smartkem, a company that has the potential to power the next generation of displays using its disruptive organic thin-film transistors (OTFTs), announced that it has entered into a joint development agreement with Shanghai Chip Foundation Semiconductor Technology Co., Ltd., a manufacturer of semiconductor and integrated circuit devices, to co-develop a new generation of microLED-based backlight technology for Liquid Crystal Displays.
The joint development agreement provides that Smartkem will supply its proprietary organic dielectric single layer material, or Redistribution Layer (RDL), to Chip Foundation to combine with its own microLED devices, for the joint development of microLED based device structures. As part of the co-development project, Smartkem will develop insulator materials that can be used by Chip Foundation to combine its own proprietary microLED devices into a high performance miniLED package containing four microLEDs wired in series. The resulting manufactured chip is expected to have the properties of high brightness coupled with high current efficiency, reducing power losses in driving backlights and improving uniformity of illumination.
Smartkem Chairman and CEO, Ian Jenks, comments, "The JDA with Chip Foundation is expected to further demonstrate the commercial viability of our dielectric single layer materials to customers in the display industry. This JDA follows closely on the heels of our technology collaboration agreement with the Industrial Technology Research Institute (ITRI) in Taiwan to enable product prototyping on its Gen 2.5 hybrid pilot line and reflects the continuing advance of our commercialization strategy."
Dr. Maosheng Hao, Chairman of Chip Foundation, comments, "Smartkem is widely recognized as a leading provider of OTFT solutions, with deep expertise and extensive experience in organic dielectric materials, organic semiconductor materials, and related processes. Their solution coating process technology is a perfect fit with Chip Foundation's specialized processes and techniques in the Mini/MicroLED domain. We believe that this collaboration between our two companies has the potential to expedite the advancement and widespread adoption of this technology by the display industry."
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Magnachip Semiconductor Announces YJ Kim to Step Down as CEO; Current Board Chairman Camillo Martino Appointed Interim CEO
08/14/2025 | PR NewswireMagnachip Semiconductor Corporation today announced that YJ Kim has agreed to step down as CEO and as a member of the Board of Directors, effective immediately. Camillo Martino, Chairman of the Board of Directors, has also been appointed Interim Chief Executive Officer, effective immediately.
Dan’s Biz Bookshelf ‘House of Huawei'
08/14/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfEva Dou’s "House of Huawei" is one of the most gripping business books I’ve read in years, and believe me, I’ve read my fair share. This is not just another corporate biography. It’s a geopolitical thriller, except every word is true. People have painted the Chinese tech giant Huawei as a villain, a threat, and an enigma in equal measure. However, Dou cuts through the noise and delivers something few Western reporters have managed: a fair, balanced, and thoroughly researched look at the company everyone in tech has an opinion about, but few understand.
Foxconn Research Institute, National Yang-Ming Chiao Tung University Jointly Create a New Era of Spatial Computing
08/08/2025 | FoxconnThis technological breakthrough was achieved by Director Guo Haozhong of the Semiconductor Division of Hon Hai Research Institute and Chair Professor at National Yang-Ming National Chiao Tung University, in collaboration with Group Leader Hong Yuheng, Researcher Xu Yezheng, and Researcher Miao Wenqian of the Semiconductor Division, and a research team led by Assistant Professor Huang Yaowei of National Yang-Ming National Chiao Tung University.
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.
Siemens Transforms Customer Engagement for Electronic Component Manufacturers with PartQuest Design Enablement
08/06/2025 | SiemensSiemens Digital Industries Software today announced the launch of the PartQuest™ Design Enablement portfolio, a new, connected digital environment for electronic component manufacturers looking to scale smarter, more personalized and persistent engagement with their customers and prospects.