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Laser Photonics Propels R&D Efforts in Wafer Marking

02/04/2025 | BUSINESS WIRE
Laser Photonics Corporation, a leading global developer of industrial laser systems for cleaning and other material processing applications, and its recently acquired subsidiary, Control Micro Systems, Inc. (CMS Laser), announced the expansion of their Laser Wafer Marking technology research and development program.

EXTOLL Collaborates with BeammWave and GlobalFoundries as Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/04/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

Building on DesignCon’s 30th Anniversary Momentum

02/04/2025 | Marcy LaRont, I-Connect007
With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.

EXTOLL Collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC

02/03/2025 | GlobalFoundries
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BeammWave, an innovation leader in mmWave 5G/6G digital beamforming, as a key SerDes IP supplier for its next gen communication ASIC development portfolio on GlobalFoundries’ (GF) 22nm FD-SOI process technology, 22FDX®.
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