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PCB Designers: ‘Level Up’ IC, Packaging Knowledge

09/16/2024 | Andy Shaughnessy, Design007 Magazine
Soo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”

ASC Sunstone Circuits to Exhibit at the Anaheim Electronics & Manufacturing Show (AEMS) 2024

09/16/2024 | ASC Sunstone
American Standard Circuits | ASC Sunstone will be exhibiting at the Anaheim Electronics & Manufacturing Show 2024 to be held October 2-3 at the Anaheim Conventions Center in Anaheim, California.

Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar

09/16/2024 | BUSINESS WIRE
Omni Design Technologies, a leading provider of high-performance, low-power data acquisition and signal-processing solutions, and Aura Intelligent Systems, a developer of high-resolution imaging radar for ADAS and autonomous vehicles, announced a partnership on Aura’s next generation digital radar development.

Comtech Launches New Digital Common Ground Modem Product Line for DoD and Coalition Customers

09/13/2024 | BUSINESS WIRE
Comtech, a global technology leader, today announced the launch of the Company’s new Digital Common Ground (“DCG”) portfolio of modems.
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