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Mycronic’s Jet Set Technology

10/02/2024 | Nolan Johnson, SMT007 Magazine
In this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.

Scrutinizing Solder Printing

09/10/2024 | Nolan Johnson, I-Connect007
As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.

Solder Printing: SMT007 Magazine—September 2024

09/03/2024 | I-Connect007 Editorial Team
In this issue of SMT007 Magazine, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging. Join us as we look at the latest in solder printing equipment, printable solder pastes, and the opportunities they present.

KYZEN to Promote Pair of Stencil Cleaning Chemistries at SMTA Chihuahua Expo & Tech Forum

07/31/2024 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, August 15, 2024 at the Hotel Sheraton Soberano in Chihuahua, Mexico.

Automatic Paste Transfer and Quick Change Squeegee for ASMPT Printers

07/23/2024 | ASMPT
ASMPT, the market and innovation leader in SMT manufacturing technology, has added two new features to its proven DEK printing platforms that automate solder paste transfers and simplify squeegee changes.
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