Worldwide Hardcopy Peripherals Shipments Decreased 1.5% Year Over Year in the Second Quarter of 2024
September 20, 2024 | IDCEstimated reading time: 1 minute
Worldwide shipments of hardcopy peripherals declined 1.5% year over year to nearly 19.2 million units in the second quarter of 2024 (2Q24). The global shipment value for all devices also declined 6.6% year over year to $8.9 billion, according to new data from the International Data Corporation (IDC) Worldwide Quarterly Hardcopy Peripherals Tracker.
Notable highlights from the quarter include:
-
The United States was one of the top regions with year-over-year growth of 0.6% in units shipped, driven by demand for HP Inc. inkjet devices, especially the ink tank sector. The company has been able to grow inkjet devices through eTailer channels and price reductions.
-
The People's Republic of China, one of the top regions in terms of units shipped, showed the largest decline (down 3.3% year over year) due to budget constraints in the commercial sector and delayed government purchases.
-
Among the top 5 companies, HP Inc., Epson, and Pantum each saw shipment growth in 2Q24 with gains of 0.1%, 4.3%, and 11.2% respectively. HP Inc. saw strong growth in China where shipments were up 28.4% year over year while Epson had a 5.6% gain in the Asia/Pacific (excluding Japan and China) region. Epson also saw continued growth in the education sector, which has higher print requirements for purposes such as worksheet and test paper printing.
Suggested Items
Global Dry Film Photoresist Market Set for Robust Growth with Expanding Semiconductor Ecosystem
06/24/2025 | PRNewswireIn 2024, the global market size of Dry Film Photoresist was estimated to be worth US$939 million and is forecast to reach approximately US$1191 million by 2031 with a CAGR of 3.5% during the forecast period 2025-2031.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
The Big Picture: Our Big ‘Why’ in the Age of AI
06/25/2025 | Mehul Davé -- Column: The Big PictureWith advanced technology, Tesla, Google, Microsoft, and OpenAI can quickly transform life as we know it. Several notable artificial intelligence (AI) studies, including the 2024 McKinsey Global Survey on AI, have offered insights into AI’s adoption, impact, and trajectory. The McKinsey study revealed that AI adoption continues to grow, with 50% of respondents reporting using AI in at least one business area.
Takeaways from the Keynotes at the Edinburgh EIPC Summer Conference
06/16/2025 | Pete Starkey, I-Connect007It was seasonably wet and windy in Edinburgh, Scotland, June 3-4, where delegates from 17 countries convened for the 2025 EIPC Summer Conference to enjoy a superlative program of 18 technical presentations over two days, plus an excursion to a whisky distillery. EIPC President Alun Morgan welcomed everyone to the Delta Hotel, reminding us that in its previous iteration, it was the Royal Scot, traditionally the annual venue of the Institute of Circuit Technology Northern Symposium.
Dalfen Industrial Closes Major Sale of One Million+ SF Houston Logistics Park to Global Tech Giant Foxconn
06/06/2025 | Globe NewswireDalfen Industrial recently announced the sale of Fairbanks Logistics Park, a premier four-building, 1,026,609-square-foot Class A industrial campus in Northwest Houston, to Foxconn.