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Suggested Items

U.S. CHIPS Act Funding Detailed on SIA Website

09/12/2025 | Nolan Johnson, I-Connect007
The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).

Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?

09/02/2025 | Dennis Fritz -- Column: Defense Speak Interpreted
In my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs: 

Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility

09/01/2025 | BUSINESS WIRE
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.

MacDermid Alpha Awarded for Innovation: Driving Process Optimization and Efficiency with Major Indian EMS Provider

08/28/2025 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading global supplier of integrated materials for the electronics industry, is recognized by one of India’s top EMS providers, Syrma SGS, with an award for innovation that advanced process optimization, enhanced operational efficiency, and yield gains.

Coming Soon: The Advanced Electronics Packaging Digest

08/27/2025 | Marcy LaRont, I-Connect007
The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
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