The Marketing Minute: Cracking the Code of Technical Marketing
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
Semtech Accelerates 5G-Advanced Infrastructure Buildouts
September 23, 2024 | BUSINESS WIREEstimated reading time: 1 minute
Semtech Corporation, a high-performance semiconductor, IoT systems, and cloud connectivity service provider, today announced sampling of GN2255S, its next generation Tri-Edge 50 Gbps clock and data recovery (CDR) with integrated DML driver for SFP56 50G PAM4 bidirectional (BiDi) and CWDM6 optical modules. As part of the industry’s only analog solutions for 50 Gbps fronthaul, the new CDR can lead to simpler, potentially more power-efficient designs. Its real-time signal processing delivers ultra-low latency crucial for 5G Advanced time-critical services, such as required in public safety, industrial control, smart grid management, and more.
According to the latest Ericsson Mobility Report, 5G subscriptions will more than double from 2024 to 2029, with mobile data traffic forecast to exceed 230 exabytes monthly by 2029. Exponential data demands, along with use cases like generative AI, machine learning (ML), and augmented reality (AR), will drive infrastructure upgrades. With its faster data transfer and improved connectivity, integration of 5G advanced technology will further boost network performance, intelligence, and sustainability.
“As a Mobile Optical Pluggable Alliance (MOPA) founding member, Semtech works closely with the world’s telecom leaders and mobile operators to develop the right optical solutions that solve industry challenges,” said Raza Khan, product marketing director for Semtech’s Signal Integrity Products Group and chief marketing officer of MOPA. “Our Tri-Edge solutions for bidirectional and CWDM optical pluggables are a direct result of these collaborations. Enabling the next round of infrastructure upgrades over single fiber will give carriers greater cost-effectiveness, flexibility and scalability to advance global mobile networks.”
“Optical pluggable innovations like Semtech’s move the industry towards the high performance and latency needed for global mobile networks to become the digital backbone of society and industry 4.0,” said Stefan Dahlfort, chairman and president of the board of MOPA.
Semtech at ECOC 2024
Semtech’s demos in booth E37, MR21, MR22 will showcase solutions for datacenter, wireless, and PON. Meetings are by appointment only.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.