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The International Electronics Manufacturing Initiative (iNEMI) is hosting an end-of-project webinar to showcase the findings of its PCB Connector Footprint Tolerance Project. This project addressed industry capabilities, risks, and mitigation strategies related to high-bandwidth I/O connector footprints, a critical aspect as bandwidth doubles every three years and connector pitch continues to shrink.
The project’s objective was to equip product designers with the necessary information to ensure predictable quality levels when using high-bandwidth connectors. Through a comprehensive literature review and the expertise of the project team, potential risks were identified, followed by the creation of a survey designed to assess supplier capabilities for quality mitigation in the PCB industry.
Webinar Highlights:
- Survey Findings: Presentation of key results from the industry-wide survey of PCB fabricators and connector manufacturers.
- Expectations vs. Reality: Discussion on the gaps and alignment between the expectations of PCB fabricators and connector manufacturers.
- Best Practices: Recommendations for quality assessment and dimension control to ensure optimal performance of high-bandwidth connectors in next-generation PCBs.
Event Details:
- Date: Monday, September 30, 2024
- Time: 11:00 a.m. – 12:00 p.m. EDT (Americas) / 5:00 – 6:00 p.m. CEST (Europe)
- Registration: Open to the public. Advance registration is required.
For more information, visit iNEMI's website. Don’t miss this opportunity to gain valuable insights into the evolving landscape of PCB connector footprints and learn about strategies for maintaining high quality in an era of increasing bandwidth demands.
