Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute

11/21/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.

Gartner Forecasts MENA IT Spending to Grow 7.4% in 2025

11/20/2024 | Gartner, Inc.
IT spending in the Middle East and North Africa (MENA) region is projected to total $230.7 billion in 2025, an increase of 7.4% from 2024, according to the latest forecast by Gartner, Inc.

North American Wi-Fi Sensing CPE Installations to Surge to 112 Million by 2030

11/15/2024 | ABI Research
Wi-Fi Sensing uses Wi-Fi RF wave attenuation to detect presence and motion, offering a cost-effective, easily deployable solution. Major Wi-Fi chipset vendors supporting infrastructure markets are backing this technology.

ISAC Has Groundbreaking Potential to Transform 6G Networks After 2033

11/11/2024 | ABI Research
Integrated Sensing and Communication (ISAC) is a groundbreaking concept aiming to turn mobile networks into radars that can sense moving objects in their vicinity. According to a new report from global technology intelligence firm ABI Research, ISAC is a revolutionary innovation poised to transform the future of 6G networks.

Hitachi, UTokyo Promote Joint Research for the Practical Application of High-resolution Laser-PEEM in the Semiconductor Field

11/07/2024 | JCN Newswire
Hitachi High-Tech Corporation and The University of Tokyo have been conducting joint research into practical applications of high-resolution Laser-PEEM(1) developed by UTokyo in the semiconductor manufacturing process.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in