Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

SIA Praises Finalization of CHIPS Incentives to Supplement SK Hynix’s $3.87 Billion Investment in Indiana

12/20/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and SK hynix. The incentives will supplement the company’s $3.87 billion investment in Indiana for advanced packaging operations and R&D.

SIA Commends Finalization of CHIPS Incentives for GlobalWafers

12/19/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending finalization of CHIPS and Science Act manufacturing investments announced by the U.S. Department of Commerce and GlobalWafers. The incentives will support the development of semiconductor wafer production in Texas and Missouri.

Statistically Testing Inner Layer Yield Improvement Projects 

12/18/2024 | Dr. Patrick Valentine, Uyemura
Can we trust our measurement system to give us reliable data? Is it accurate, repeatable, and reproducible? Measurement is the foundation of quality. We measure for two primary reasons: to make decisions on product quality and to provide data that will inform continuous improvement projects. We can engage in continuous improvement projects if we are confident in our measurement systems.

PCB Fabricator Cistelaier Receives ESA Qualification

12/16/2024 | Cistelaier
The capability and independence of its space industry are strategic for Europe, and the European Space Community needs a qualified, resilient supply chain with adequate production capacity. Specifically, it requires greater production capacity in PCB manufacturing. On this premise, in early 2020, Cistelaier began the process of obtaining an ESA qualification.

INVISIO, U.S. Defense Innovation Unit (DIU) Advancing Wireless Tactical Communications Through Customer Collaboration

12/09/2024 | INVISIO
A cooperation between INVISIO and the U.S. Defense Innovation Unit (DIU) has showcased the benefits of co-development when it comes to developing tactical communications solutions for military operators at speed, resulting in the INVISIO Link™ solution.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in