-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueEngineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
Technology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
GPV Enters Power Purchase Agreement for Danish Solar Park
September 26, 2024 | GPVEstimated reading time: Less than a minute
Recently, GPV entered into a Power Purchase Agreement (PPA) with Reel for its Danish entities. The PPA supports the construction of a 14,00 GWh/year solar park situated at Mesballe on Djursland in Denmark.
With the agreement, GPV purchases approx. 5% of the solar park’s expected production. The electricity will be used at GPV’s two Danish production sites in Tarm and Aars. The agreement covers around 1/3 of GPV’s Danish electricity consumption at the two Danish production sites.
The agreement is valid for five years from when the park is put into operation, expected in December 2024.
“I am very pleased with this agreement which will bring us one step closer to our GHG 2028 target. We have ambitious targets to reduce our scope 1 & 2 carbon emission intensity by 70% towards 2028 (baseline 2020) through various reduction and optimisation initiatives as well as through PPAs and we are actively looking into pursuing additional PPA agreements in other European countries,” says Bo Lybæk, CEO at GPV Group A/S.
Suggested Items
SIA Commends Finalization of CHIPS Incentives for TSMC
11/18/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.
Keysight Providing Software to Enable Researchers through the Microelectronics Commons
11/15/2024 | Keysight TechnologiesKeysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).
ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland
11/13/2024 | ITW EAEITW EAE, announces a new partnership agreement with Etek Europe to further expand its representation and distribution network. Under this agreement, Etek Europe will represent Despatch products in the United Kingdom and Ireland.
Inventec Performance Chemicals and Nano-Join are Teaming Up to Deliver Sintering Solutions
11/08/2024 | SMTAWith great excitement we announce to have signed a license agreement with NANO-JOIN GmbH to use their sintering technology and integrate it into our ECORELTM SINTEC product line.
Teledyne to Acquire Micropac
11/04/2024 | BUSINESS WIRETeledyne Technologies Incorporated and Micropac Industries, Inc. jointly announced that they have entered into a definitive merger agreement that provides for the merger of Micropac with a wholly-owned subsidiary of Teledyne.