Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
EMA Webinar: Maximize Your Design Productivity in OrCAD X and Allegro X
September 26, 2024 | EMA Design AutomationEstimated reading time: Less than a minute
Learn how the extensible environment in Cadence OrCAD X and Allegro X is being used to enhance and customize the PCB design flow in a webinar held by EMA on Tuesday, October 1st, 2024 @ 11am ET.
What You Will Learn:
- See how the powerful SKILL framework in PCB Editor can be used to create countless time-saving routines and utilities.
- Explore how you can leverage pre-build utilities designed to drastically improve your productivity
- Learn how you can speed up tedious yet important tasks like documentation and drafting as well as integrate support for newer technologies like stretch flex and AOI technologies
- Explore around 50 FloWare utilities built to help you get more done faster
Join special guest, Rolf Nick from FlowCAD.
Visit the EMA Acadamy webpage to learn more and register for the event.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/10/2025 | Nolan Johnson, I-Connect007I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.
New Fil Arzola Class: Designing for the Future, and for Sustainability
10/07/2025 | Andy Shaughnessy, I-Connect007If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.
American Standard Circuits to Exhibit at SMTA International
10/06/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again exhibit at SMTA International 2025 to be held at the Donald E Stephens Convention Center in Rosemont, Illinois on October 19th through the 23rd, 2025.
It’s Only Common Sense: Stop Whining About the Market—Outwork It
10/06/2025 | Dan Beaulieu -- Column: It's Only Common SenseWhenever the market hiccups or the industry cycle dips, I hear the same tired chorus: “The market is down. Customers aren’t buying. What can we do? We just have to wait it out.” Nonsense. If you think that by showing up, opening your doors, and waiting for the economy to smile kindly upon you, that success will follow, you are in the wrong business. Worse yet, you’re living in the wrong mindset. Most people don’t want to hear the truth that winners find business in down cycles. Losers blame the economy.
Intel Shares Surge Following Report of Early Talks to Make Chips for Rival AMD
10/03/2025 | I-Connect007 Editorial TeamIntel shares jumped on October 1, following reports that the company is in early talks to manufacture chips for rival AMD through its foundry business, according to CNBC.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in