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Five Ways to Revolutionize EMS Sales With AI

10/22/2025 | Nolan Johnson, SMT007 Magazine
If you’ve been in the EMS game for any length of time, you know the sales cycle can be a challenge to navigate. It’s complex, technical, and often a marathon, not a sprint. With OEMs demanding faster turnarounds, tighter margins, and bulletproof supply chains, the pressure is on for EMS providers to stand out in a crowded field.

Global Electronics Association Releases Fall Schedule of Instructor-led Courses

10/20/2025 | Corey Lynn, Global Electronics Association
Whether you’re looking to enhance your PCB design skills, explore advanced packaging technologies, or deepen your understanding of reliability, these Global Electronics Association courses deliver high-impact learning from the best in the industry. Here are a few starting this week.

SEMICON West: The Path to a $1 Trillion Future

10/14/2025 | Marcy LaRont, I-Connect007
After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/10/2025 | Nolan Johnson, I-Connect007
I-Connect007 has a new monthly digest newsletter, the Advanced Electronic Packaging Digest, and as I was scanning our advanced packaging newsfeeds this week, I came across a primer from tokenring.ai (republished through station WRAL, Raleigh, North Carolina), which I found quite useful. Whether you’re a designer, fabricator, or assembler, the package schemes being developed will change how you work, so be sure to keep your eye on the technological horizon and subscribe to the monthly Advanced Electronic Packaging Digest.

New Fil Arzola Class: Designing for the Future, and for Sustainability

10/07/2025 | Andy Shaughnessy, I-Connect007
If you have not yet taken a class from Fil Arzola, you are missing out. In late October, Fil will be teaching the class "Building Sustainable Model-Based PCBs," speaking from the design perspective. I had the pleasure of catching this course at last year's IPC APEX EXPO, and I walked away with a lot to think about. I asked Fil to discuss his upcoming course. Registration is open now.
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