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Connect the Dots: Designing for Reality: Outer Layer Imaging

09/26/2024 | Matt Stevenson -- Column: Connect the Dots
Welcome to the next step in the manufacturing process—the one that gets the chemical engineer in all of us excited. I am referring to outer layer imaging, or how we convert digital designs to physical products. On a recent episode of I-Connect007’s On the Line with… podcast, we explained how the outer layer imaging process maps the design’s unique features onto the board.

Siemens Extends Collaboration with TSMC to Advance Integrated Circuit and Systems Design

09/25/2024 | Siemens
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications and innovative technology enablement for the foundry’s newest process technologies.

Würth Elektronik at electronica 2024

09/25/2024 | Wurth Electronics
Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.

Cross-domain Design: The Key to Managing Complex Methodologies

09/23/2024 | Andy Shaughnessy, Design007 Magazine
For years, Cadence Design Systems has been developing EDA tools that enable the design of ICs and PCBs. Now, as systems continually become more complex, the lines are blurring between these disciplines, and EDA companies are providing designers of PCBs and ICs the ability to understand what’s happening upstream and downstream. We asked John Park, product management group director for advanced IC packaging at Cadence, to discuss this ongoing convergence of domains, as well as what it all means to designers and design engineers.

ASC Sunstone Circuits to Present Lunch and Learn and Exhibit at PCB West 2024

09/24/2024 | ASC Sunstone
ASC Sunstone Circuits will be exhibiting at PCB West 2024 Conference and Exhibition to be held from October 8th through the 11th at the Santa Clara Convention Center in Santa Clara, California.
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