American Made Advocacy: Success in Washington Requires Patience, Persistence, and Sustained Focus
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Defense Speak Interpreted: SWaPing Nanosatellites for Defense Systems
Indium to Showcase Industry-Leading Solder Paste and Alloy Technology at Detroit Battery Show
October 1, 2024 | Indium CorporationEstimated reading time: 1 minute
As one of the leading materials providers to the electronics assembly industry, Indium Corporation® is proud to feature its industry-leading Durafuse® solder technology at the Battery Show North America, October 7-10, in Detroit, Michigan.
Indium Corporation will showcase the following among its featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indalloy®301 LT Alloy for Preforms/InFORMS® is a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
Indium Corporation’s innovative solder and alloy technologies are designed to meet the stringent requirements of the electric vehicle market, where thermal management, reliability, and energy efficiency are paramount. The ability to enhance thermal cycling performance and reduce energy consumption aligns with the industry's drive towards sustainability and longer-lasting products. By offering advanced materials solutions like Durafuse® and Indalloy®, Indium Corporation helps automakers and battery manufacturers tackle the challenges of electrification and develop next-generation EV technologies.
To learn more about Indium Corporation’s solutions, visit our experts at the Detroit Battery Show in hall A-C, booth #733.
Share on:
Suggested Items
Has the Time Finally Come for Tin-nickel Plating?
12/09/2024 | Marcy LaRont, PCB007 MagazineIn the 1980s, Electrochemicals, Inc. (now Electrochemical Products) made a significant shift from furniture and industrial goods to electronics and manufacturing. During this journey, a tin-nickel plating alloy was developed. In 1984, Mike Carano, a young engineer, published a paper on tin-nickel plating alloy, but after some initial attention, the plating solution fell into obscurity. Today, PCB fabrication looks largely the same, yet changes are afoot, chiefly due to the demands for very fine feature capability on printed circuit boards, as well as environmental sustainability. So, in this fascinating conversation with Mike Carano and Happy Holden, we take another look at tin-nickel and its advantages in both performance and sustainability.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
AIM to Present on High Reliability and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA South China Expo & Tech Forum
10/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA South China Expo & Tech Forum taking place November 6-7 at the Shenzhen World Exhibition & Convention Center in Shenzhen, China.
Some Fundamentals of Tin-Bismuth Metallurgy and Electromigration
09/24/2024 | Prabjit Singh, Raiyo Aspandiar, Haley Fu, and L. A. SwaminathanNear-eutectic tin-bismuth alloy is a strong contender as the solder of choice for low-temperature electronic assembly applications. This article will describe the recent significant developments by the iNEMI project team on the understanding of the electromigration behavior of Sn-Bi solder which has a unique physical metallurgy and electromigration behavior quite different for that of Sn-Ag-Cu (SAC) solder and other solders in common use today.
iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
09/19/2024 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes.