Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Has the Time Finally Come for Tin-nickel Plating?
December 9, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
In the 1980s, Electrochemicals, Inc. (now Electrochemical Products) made a significant shift from furniture and industrial goods to electronics and manufacturing. During this journey, a tin-nickel plating alloy was developed. In 1984, Mike Carano, a young engineer, published a paper on tin-nickel plating alloy, but after some initial attention, the plating solution fell into obscurity.
Today, PCB fabrication looks largely the same, yet changes are afoot, chiefly due to the demands for very fine feature capability on printed circuit boards, as well as environmental sustainability. So, in this fascinating conversation with Mike Carano and Happy Holden, we take another look at tin-nickel and its advantages in both performance and sustainability.
Marcy LaRont: Mike, please explain the unique metal properties of the tin-nickel alloy and why fabricators should consider this as a surface finish solution today.
Mike Carano: Tin-nickel is a metastable alloy. It is monatomic, meaning that no matter what you do with the chemistry or how you manipulate the grams per liter of one metal or the other (or the amps per square foot), it always comes out as 65% of one metal and 35% of the other. I’m not aware this is true with any other combination of metals.
Typically, if your chemistry is out of balance—if you have more tin in the solution than you have lead—you will plate more tin. It’s precisely why there are so many alloys out there. In that respect, tin-nickel is pretty amazing.
Happy Holden: When I was at Hewlett-Packard, Dr. Morton Adler from Bell Labs called me and said he wanted us to fab his boards using tin-nickel, because he knew we were using it. I plated the boards with tin-nickel and added a gold strike. This thin gold was cobalt-hardened and the final thickness was still only 3–5 microinches when we finished. About a month after I sent them back to Adler, I got another call. He said, “What the hell did you send me? We’ve completed our reliability testing and your 3–5 microinches on tin-nickel outperforms our 120 microinches of sulfamate nickel on our contacts and other relays.”
Continue reading this conversation in the November 2024 issue of PCB007 Magazine.
Share on:
Suggested Items
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
Scanfil Signs New Customer and Starts Manufacturing Control Units for Emerson
06/19/2025 | ScanfilScanfil and Emerson signed an agreement concerning the Rosemount Tank Radar for Advanced Level Measurement Solutions. Emerson is a global technology, software and engineering company domiciled in the USA.
Specialty Coating Systems (SCS) Relocates to New Custom-Built Site in Switzerland
06/19/2025 | Specialty Coating Systems (SCS)Specialty Coating Systems (SCS) is pleased to announce the relocation of its Switzerland operations to a new custom-built facility. The approximately 2,200 square-meter coating operation, which is located at Rue du Collège 43, 2300 La Chaux-de-Fonds, is ISO 9001:2015 certified and specifically designed to optimize quality and provide excellent service for customers across the medical device, electronics, aerospace and automotive markets.
Cadence AI Autorouter May Transform the Landscape
06/19/2025 | Andy Shaughnessy, Design007 MagazinePatrick Davis, product management director with Cadence Design Systems, discusses advancements in autorouting technology, including AI. He emphasizes a holistic approach that enhances placement and power distribution before routing. He points out that younger engineers seem more likely to embrace autorouting, while the veteran designers are still wary of giving up too much control. Will AI help autorouters finally gain industry-wide acceptance?
Felix Martinez Promoted to Insulectro VP of Operations
06/19/2025 | InsulectroInsulectro is pleased to announce the internal promotion of Felix Martinez to Vice President of Operations.