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Connect the Dots: Five Best Practices for Designing Flex and Rigid-flex PCBsDepartment of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
October 1, 2024 | U.S. Department of DefenseEstimated reading time: 1 minute
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy (ASD(IBP)). "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."
"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Mr. Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within OASD(IBP).
This was the 70th award the DPAP program issued across multiple areas in Fiscal Year 2024, for a total value of $672 million. The DPAP office is overseen by the MCEIP directorate.
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