-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Mycronic’s Jet Set Technology
October 2, 2024 | Nolan Johnson, SMT007 MagazineEstimated reading time: 2 minutes

In this interview, Wolfgang Heinecke, head of global product management at Mycronic, discusses advancements and applications of jet printing technology, which offers solutions to the challenges faced by traditional stencil printing. He highlights the key benefits of jet printing, and explains the qualification process for solder paste compatibility as well as the software-driven nature of jet printing, which allows for quick program creation and real-time adjustments.
Nolan Johnson: Wolfgang, let’s start with your background.
Wolfgang Heinecke: I started at Siemens in 2000, working in product management and marketing before I moved to SIPLACE sales in France. I joined ASYS Group in 2013; I spent five years in Singapore, in charge of sales and service for ASYS in the rest of Asia, before joining Mycronic in 2018 in Germany as sales director for DACH. About 18 months ago, I joined Mycronic headquarters to lead product management. I have a team of five people, each one in charge of different product lines, including jet printing.
Jet printing is a completely different approach. It avoids all the challenges of stencil printing. Nothing touches the PCB so there's no need for stencils. You don’t need alignment between the stencil and PCB. You have the freedom to operate and to bring in the amount of solder paste you need in each place.
The printing challenges are increasing. If you look, for example, into heavy EV boards, you’ll find small chip components close to tall connectors. This puts stencil printers through a lot of challenges because you need either step stencils or you need to find a solder paste compromise for the complete PCB. However, with a jet printer, we have the possibility to solve this.
The jet printer itself is built on a high-performing gantry system and a printhead capable of depositing ultra-small droplets: one to two nanoliters, up to 300 times per second (300 Hertz). This means one million dots per hour or even more. This combination makes jet printing technology perfect for random dot dispensing.
In 2005, with the MY500, the goal was to replace stencil printing. We’re not there yet fully. Stencil printing has its place when it comes to printing speed—like in a placement machine, the jet printer goes from pad to pad, shooting solder paste deposits on the fly.
Nevertheless, market demand for jet printing is on the rise due to the increasingly challenging characteristics of PCBs. Some large automotive electronics manufacturers are looking into this because their EV boards have bigger component variety. Now they are combining stencil print and jet print to bring all the advantages together.
To continue reading this interview, which originally appeared in the September 2024 SMT007 Magazine, click here.
Suggested Items
Flexible Thinking Flexible Circuit Technology—Looking Back and Forward
03/03/2025 | Joe Fjelstad -- Column: Flexible ThinkingFlexible circuit technology came on the scene as a solution largely for niche applications, however, the technology has emerged in recent years as a cornerstone of modern electronics. Today, the technology is enabling a broad range of new product designs across industries. From wearable devices and medical implants to foldable smartphones and numerous automotive applications, flexible circuits are arguably at the heart of much of the next generation of innovations.
Yamaha Motor to Launch New YRP10e Entry-Level Solder Paste Printer
02/26/2025 | Yamaha Motor Europe Robotics, SMT SectionYamaha Motor Europe Robotics SMT Section announces that it will release the new YRP10e solder paste printer on April 1 of this year.
Transition Automation Receives Multiple Large-Format Permalex Squeegee Orders from Top Space Technology Customer
02/24/2025 | Transition AutomationTransition Automation, Inc. (TA) has qualified to supply a top tier Space and Satellite Technology provider’s SMT Printing Process through multiple large-format orders for Permalex Edge Universal Holder and Blade systems with Soft-Touch Paste Retainers.
Incap Slovakia Enhances SMT Quality with Automated Paste Inspection
02/07/2025 | IncapAt Incap Slovakia, quality and efficiency are at the core of our Surface Mount Technology (SMT) production. To further strengthen process control and minimise defects, we have implemented Automated Paste Inspection (API)—a high-precision system that ensures the accuracy and consistency of solder paste printing.
Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
01/17/2025 | PetersPeters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).