Siemens Collaborates with GlobalFoundries to Certify Analog FastSPICE
October 2, 2024 | SiemensEstimated reading time: 2 minutes

Siemens Digital Industries Software announced that GlobalFoundries (GF) has certified Siemens’ industry leading Analog FastSPICE (AFS) platform for GF’s 22FDX®, 22FDX+, 12LP, and 12LP+ Process Design Kits (PDKs). With these certifications, mutual customers using Siemens’ AFS tool can now leverage the exceptional performance and power efficiency of these GF processes.
AFS is a key part of Siemens’ Solido™ Simulation Suite software. It provides leading-edge circuit verification for nanometer analog, radio frequency (RF), mixed-signal, memory, and custom digital circuits. This proven Siemens EDA solution provides a unified platform for the broader integrated circuit (IC) design industry to develop mixed-signal and variation-aware verification capabilities with SPICE accuracy, high performance, high capacity and ease of use.
“Siemens is pleased to collaborate with GlobalFoundries as we continue to deliver advanced technologies that help our shared customers deliver innovative and compelling ICs to market more quickly,” said Amit Gupta, general manager, Custom IC Verification, Siemens Digital Industries Software. “We look forward to the successful end-products that our customers can soon develop with this new design solution kit.”
GF’s 12nm FinFET platform is built using FinFET technology and offers high-performance SoC integration with low-power memory and logic. The platform allows for seamless integration of digital and analog circuitry on the same chip, enabling more efficient designs for applications such as wireless communications, sensor interfaces, and automotive electronics. Siemens’s AFS platform is now certified for 12LP and 12LP+ processes. In addition, Siemens and GF have an active partnership with Si2’s Compact Model Coalition (CMC) in the development of Open Model Interface (OMI), the industry-standard platform for enabling aging modeling and reliability analyses. GF's 12LP and 12LP+ processes are now enabled with OMI, the industry-standard platform for enabling aging modeling and reliability analyses.
Siemens’ AFS is now certified for 22FDX+, a derivative of GF’s 22FDX® platform with half-node performance and power improvements. 22FDX and 22FDX+ are built using FD-SOI technology that delivers high performance, minimal leakage and exceptional power efficiency. These platforms also support seamless integration of digital and analog circuitry on the same chip, enabling more efficient designs for applications such as wireless communications, sensor interfaces, and automotive electronics.
“Our ongoing collaboration with Siemens continues to deliver strong value for our shared customers and the broader GlobalFoundries ecosystem,” said Richard Trihy, senior vice president of Design Technology Enablement at GF. “With our combined expertise and dedication to innovation, GF and Siemens EDA are shaping the future of manufacturing and beyond.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Siemens Collaborates with TSMC to Accelerate 3D IC and AI-driven Circuit and Systems Design
09/24/2025 | SiemensAt the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies.
Siemens Launches Lighthouse Project of Made for Germany Initiative
09/23/2025 | SiemensIn the presence of political leaders and representatives of the business community, Siemens today laid the cornerstone for the new Siemens Technology Campus in Erlangen, Germany. A lighthouse project of the Made for Germany initiative, the Technology Campus will further strengthen the economic viability of Germany and the region primarily in the area of power electronics.
Siemens Accelerates Complex Semiconductor Design and Test with Tessent IJTAG Pro
09/22/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced Tessent™ IJTAG Pro software, which will transform IJTAG (IEEE 1687) input/output by enabling parallel operations of the traditionally serial operation and provide read and write access to custom hardware.
Siemens, TRUMPF Partner to Accelerate Digital Manufacturing and AI Readiness
09/16/2025 | SiemensTechnology company Siemens and leading machine tools and laser manufacturer TRUMPF announced a partnership that promises to elevate industrial production by harnessing advanced digital manufacturing solutions.