TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation

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Tazmo Co., Ltd. and TAIFLEX Co., Ltd.  held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei. Witnessed by Dr. Johnny Jhong-Ming Huang, chairman of the Institute for Information Industry, the T&T Industrial Cooperation Alliance was officially established. Domestic and foreign supply chain representatives attended the ceremony to show their strong support and expectations for T&T Alliance.

TAZMO is one of the leading semiconductor equipment suppliers in Japan and is renowned for its excellent quality, service, and advanced technology. TAZMO provided a variety of equipment for the semiconductor advanced packaging area and its products were widely adopted by major Foundry and OSAT customers in the world.

TAIFLEX is the Global leading supplier of FPC-related materials. Through the keeping investment and research, TAIFLEX has successfully developed materials for semiconductor advanced packaging and the products have been certificated by global OSAT customers. In order to provide the best service to global customers, TAIFLEX has built a 100% owned subsidiary TAiCHEM Materials Corporation to focus on this business.

TAZMO and TAIFLEX recognize that there will be great synergy in each other's technology and customer service capabilities. In order to strengthen a cooperative relationship and provide better services to customers, the two parties all agreed to sign the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” and build the Taiwan-Japan Semiconductor Industrial Cooperation Alliance, named the “T&T Industrial Cooperation Alliance”. The T&T Alliance was based on the prefixes of TAZMO and TAIFLEX, to demonstrate the ambition of Japanese equipment manufacturers and Taiwanese advanced materials manufacturers to cooperate through the alliance and integrate each other's resources to strengthen supply chain services.

Institutional Investors said that the target customers served by the T&T Alliance include domestic first-tier Foundry and OSAT customers. Through the technical support of Japanese original equipment providers and local real-time service capabilities, the alliance's products and services for customers will be expanded. At present, major international semiconductor manufacturers are expanding their investment in Japan. The establishment of the T&T Alliance means that the close collaboration between the upstream and downstream semiconductor supply chains of Taiwan and Japan will continue to deepen and accelerate the development of products and services to customers. It is believed that with the complementary advantages of Taiwan and Japan enterprises, they will be able to demonstrate strong competitiveness and remain in the leading position of the international semiconductor market.

The MOU was signed by TAZMO President Yasuyuki Sato and TAIFLEX Chairman Ta-wen Sun, witnessed by Dr. Johnny Jhong-Ming Huang, chairman of the Institute for Information Industry. In the future, the two parties will jointly develop products and applications in the field of advanced packaging, provide customers with complete and immediate total solutions, and work together to expand the advanced packaging market.

It is known that the two parties had set up a joint R&D center in Kaohsiung. (At the same time, TAZMO's Kaohsiung office has also been officially operated.) The collaboration between the two parties will get closer and closer.

As the “Southern Semiconductor S Corridor” continued to attract large-scale investment from domestic and international iconic semiconductor companies, the demand for semiconductor advanced packaging technology in AI applications continues to grow rapidly. It is believed that the T&T Alliance could grasp this great opportunity to create a flexible and resilient local supply chain to provide high-quality products and instant services to all customers and keep growing together.