-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
TAZMO, TAIFLEX Ink MoU on Taiwan-Japan Semiconductor Cooperation
October 4, 2024 | TAIFLEX Scientific Co. LtdEstimated reading time: 2 minutes
Tazmo Co., Ltd. and TAIFLEX Co., Ltd. held a public signing ceremony and press conference for the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” in Taipei. Witnessed by Dr. Johnny Jhong-Ming Huang, chairman of the Institute for Information Industry, the T&T Industrial Cooperation Alliance was officially established. Domestic and foreign supply chain representatives attended the ceremony to show their strong support and expectations for T&T Alliance.
TAZMO is one of the leading semiconductor equipment suppliers in Japan and is renowned for its excellent quality, service, and advanced technology. TAZMO provided a variety of equipment for the semiconductor advanced packaging area and its products were widely adopted by major Foundry and OSAT customers in the world.
TAIFLEX is the Global leading supplier of FPC-related materials. Through the keeping investment and research, TAIFLEX has successfully developed materials for semiconductor advanced packaging and the products have been certificated by global OSAT customers. In order to provide the best service to global customers, TAIFLEX has built a 100% owned subsidiary TAiCHEM Materials Corporation to focus on this business.
TAZMO and TAIFLEX recognize that there will be great synergy in each other's technology and customer service capabilities. In order to strengthen a cooperative relationship and provide better services to customers, the two parties all agreed to sign the “Memorandum of Understanding on Taiwan-Japan Semiconductor Cooperation” and build the Taiwan-Japan Semiconductor Industrial Cooperation Alliance, named the “T&T Industrial Cooperation Alliance”. The T&T Alliance was based on the prefixes of TAZMO and TAIFLEX, to demonstrate the ambition of Japanese equipment manufacturers and Taiwanese advanced materials manufacturers to cooperate through the alliance and integrate each other's resources to strengthen supply chain services.
Institutional Investors said that the target customers served by the T&T Alliance include domestic first-tier Foundry and OSAT customers. Through the technical support of Japanese original equipment providers and local real-time service capabilities, the alliance's products and services for customers will be expanded. At present, major international semiconductor manufacturers are expanding their investment in Japan. The establishment of the T&T Alliance means that the close collaboration between the upstream and downstream semiconductor supply chains of Taiwan and Japan will continue to deepen and accelerate the development of products and services to customers. It is believed that with the complementary advantages of Taiwan and Japan enterprises, they will be able to demonstrate strong competitiveness and remain in the leading position of the international semiconductor market.
The MOU was signed by TAZMO President Yasuyuki Sato and TAIFLEX Chairman Ta-wen Sun, witnessed by Dr. Johnny Jhong-Ming Huang, chairman of the Institute for Information Industry. In the future, the two parties will jointly develop products and applications in the field of advanced packaging, provide customers with complete and immediate total solutions, and work together to expand the advanced packaging market.
It is known that the two parties had set up a joint R&D center in Kaohsiung. (At the same time, TAZMO's Kaohsiung office has also been officially operated.) The collaboration between the two parties will get closer and closer.
As the “Southern Semiconductor S Corridor” continued to attract large-scale investment from domestic and international iconic semiconductor companies, the demand for semiconductor advanced packaging technology in AI applications continues to grow rapidly. It is believed that the T&T Alliance could grasp this great opportunity to create a flexible and resilient local supply chain to provide high-quality products and instant services to all customers and keep growing together.
Suggested Items
SEMI Forecasts 69% Growth in Advanced Chipmaking Capacity Through 2028 Due to AI
06/26/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today reported findings from its latest 300mm Fab Outlook report. The report shows global front-end semiconductor suppliers are accelerating expansion efforts to support the surging demand for generative AI applications.
Nordic Semiconductor Acquires Memfault
06/25/2025 | Nordic SemiconductorNordic Semiconductor, a global leader in low-power wireless connectivity solutions, today announces the acquisition of its long-term partner, Memfault Inc., the market-leading cloud platform provider for large-scale deployments of connected products. This marks a major leap in Nordic’s evolution - from a hardware supplier to a complete solution partner.
IEEE Study Describes Breakthroughs in Semiconductor Nanolasers for Ultra-Efficient Optical Technologies
06/25/2025 | PRNewswireA new wave of innovation is transforming the future of optical technologies, driven by rapid advancements in semiconductor nanolasers. These advances are essential for future applications such as on-chip optical communication and neuromorphic computing, which require compact, energy-efficient light sources.
Strategic Silicon: How Geopolitics Is Redirecting Semiconductor Investment
06/25/2025 | IDTechExGeopolitical tensions are redirecting global investments in advanced semiconductor technologies, reshaping the semiconductor supply chain in pursuit of technological sovereignty.
NXP Completes Acquisition of TTTech Auto to Accelerate the Transformation to Software-Defined Vehicles
06/21/2025 | NXP SemiconductorNXP Semiconductors N.V. announced the completion of the acquisition of TTTech Auto , a leader in innovating unique safety-critical systems and middleware for software-defined vehicles (SDVs), pursuant to the terms of the previously announced agreement from January 2025.