CheckSum Doubles Parallel Test Output with The Release of the ILS-X2
October 7, 2024 | CheckSumEstimated reading time: 1 minute

CheckSum, a leading provider of innovative solutions for PCBA testing, is proud to announce the launch of its latest advancement: the ILS-X2 Dual Panel Automated Test System.
“The PCBA manufacturing industry continues to see the trend of more boards being built in panels, accelerating the output of modern high-speed SMT lines,” stated James Holava, Sales Director at CheckSum. “SMT lines can produce a panel of 8 boards in nearly the same time it takes to produce a panel of 2, yet traditional test cells struggle to keep pace with this increased output. This often results in a growing backlog of untested inventory on many factory floors. CheckSum’s test solutions are designed to solve the panel problem while improving both quality and efficiency.”
The new ILS-X2 automated test system enables more tests to be performed in parallel, integrating ICT, ISP, and Parallel Functional Tests like LIN, CAN, BIST, Current, Voltage and others into a single test system to meet the demands of modern production environments.
The ILS-X2 effectively doubles the parallel test output advantage by supporting the handling and testing of two panels simultaneously.
Key Benefits of CheckSum’s Parallel Dual Panel Test for Manufacturers of PCBAs:
- Parallel Speed Enables Real Time Data, Reducing Risk of Scrap and Rework
- Combining ICT, ISP and PFT Reduces Costs for Test Systems, Operators & Floor Space
- Testing Functional Tests Like LIN Earlier, Improves Quality & Reduces Burden at EOL Test
See a live demo at Electronica 2024 at booth A3.242, CheckSum will be showcasing the ILS-X2’s full potential with a live demonstration of two 8-up panels running ICT, ISP, and LIN functional tests across 16 devices under test (DUTs) in parallel. This live display will highlight how the ILS-X2 transforms traditional testing methodologies, helping manufacturers meet their production goals faster and more efficiently.
Suggested Items
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/10/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.
The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
07/02/2025 | Global Electronics AssociationThe Global Electronics Association announces the release of IPC-8911, Requirements for Conductive Yarns for E-Textiles Applications. This first-of-its-kind global standard establishes a clear framework for classifying, designating, and qualifying conductive yarns—helping to address longstanding challenges in supply chain communication, product testing, and material selection within the growing e-textiles industry.
Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.