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October Issue of Design007 Magazine: Partial HDI
October 8, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Partial HDI refers to the targeted use of HDI, usually on one section of one layer of the board. It offers designers an avenue for escape routing from BGAs with a pitch of .5 mm or less, when a mechanically drilled plated through-hole is impossible. With HDI relegated to one layer of the board, fabricators can avoid the expense of sequential lamination cycles.
In the October issue of Design007 Magazine, our expert contributors provide a complete, detailed view of partial HDI. Most experienced PCB designers can start using this approach right away. But you need to know these tips, tricks and techniques first.
Suggested Items
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
Standard of Excellence: The Power of Personalization in Customer Care
02/19/2025 | Anaya Vardya -- Column: Standard of ExcellenceProviding outstanding customer care is essential, yet many companies struggle to deliver service that leaves a lasting, positive impression. The secret lies in personalization. When you tailor your services to meet the unique needs of your customers, you win their loyalty and position yourself as a partner in their success. Here’s how personalization can transform your customer care strategy and elevate your business.
Calumet Electronics Expands Domestic Manufacturing with Capital Investments
02/12/2025 | Calumet ElectronicsCalumet Electronics Corporation, one of America’s most reliable and innovative printed circuit board suppliers, is committed to advancing technologies that are critical to the nation’s aerospace, defense, and commercial markets. In support of that mission, the company is making significant capital investments in equipment to produce high-reliability, high-density interconnect (HDI) printed circuit boards.
UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
02/06/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)