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Real Time with... IPC APEX EXPO 2025: Insights into PCB Design and Manufacturing with Polar Instruments

04/03/2025 | Real Time with...IPC APEX EXPO
Erik Bateham discusses Polar's latest book, which enhances insights for PCB designers and manufacturers. The book, "The Designer's Guide to... More Secrets of High-Speed PCBs," features a guest chapter on 2D via design modeling. Erik highlights the industry's shift towards UHDI and the challenges in measuring at micron levels.

Global PCB Connections: A Field Engineer’s Perspective on the Top 10 Trends to Watch

03/27/2025 | Jerome Larez -- Column: Global PCB Connections
As a field application engineer for a major Chinese PCB company, I see firsthand the challenges and, more excitingly, the trends shaping our industry. Talking to engineers, designers, and procurement teams worldwide, one thing is clear: PCBs have come a long way, but we’re barely scratching the surface of what’s possible. Here are 10 trends I believe will define our industry over the next decade.

Electroninks' MOD and iSAP Game Changers

03/25/2025 | Marcy LaRont, PCB007 Magazine
Electroninks, a prominent player in particle-free conductive inks, recently announced an exciting new range of metal-complex inks for ultra high density interconnect (UHDI) technology. At the SMTA UHDI Symposium in January, Mike Vinson, COO of Electroninks, gave a presentation on this line of MOD inks, which are versatile and suitable for a range of applications that require ultra-dense, miniaturized, and high-frequency technology. Mike says his technology is a game changer and will revolutionize UHDI circuit fabrication. 

Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI

03/12/2025 | Ventec International Group
Ventec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/07/2025 | Andy Shaughnessy, I-Connect007
It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we?
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