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Advanced Electronics Packaging Digest

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Brewer Science Acquires Heraeus Epurio Semiconductor Chemicals Business

08/05/2026 | PRNewswire
Brewer Science, Inc., a global leader in advanced materials and processes for the fabrication of cutting-edge microdevices, announced it has completed its acquisition of the semiconductor chemicals business line of Heraeus Epurio, a recognized technology leader in ultrapure electronic chemicals for the semiconductor industry.

Lockheed Martin to Acquire Ultra Maritime Solutions

07/06/2026 | PRNewswire
Lockheed Martin announced the signing of a definitive agreement to acquire Ultra Maritime, a global defense company specializing in advanced undersea warfare and anti-submarine warfare (ASW) capabilities for allied naval forces for $3.45 billion.

NVIDIA's 800V Power Rack Debuts with Vera Rubin

06/25/2026 | TrendForce
TrendForce's latest research on power architectures for AI servers highlights that NVIDIA has been developing its proprietary 800V HVDC Power Rack.

TTM Technologies Opens Ultra-HDI Manufacturing Facility in Syracuse, NY

06/23/2026 | TTM Technologies
TTM Technologies, Inc., a leading U.S. manufacturer of advanced electronics and interconnect solutions for aerospace, defense, and high-technology markets, today celebrated the ribbon-cutting and grand opening of its new Ultra-High-Density Interconnect (Ultra-HDI) printed circuit board (PCB) manufacturing facility in Syracuse, New York — marking a significant investment in domestic defense electronics manufacturing.

MacDermid Alpha Introduces ALPHA® OM-377 Solder Paste for Reliable Ultra-Fine Feature Printing at Production Scale

06/04/2026 | MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistry solutions for the electronics industry, announced the launch of ALPHA® OM-377, a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies.
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