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On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available

10/29/2025 | I-Connect007
I-Connect007 is excited to announce the release of the seventh episode of its 12-part podcast series, On the Line With… American Standard Circuits: Ultra HDI. In this episode, “Solder Mask: Beyond the Traces,” host Nolan Johnson sits down with John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, to explore the essential role that solder mask plays in the Ultra HDI (UHDI) manufacturing process.

Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication

10/15/2025 | I-Connect007
I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.

I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series

10/10/2025 | I-Connect007
In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.

How Does UHDI Improve Routing Capabilities? Listen to Episode 3 Now and Discover

09/29/2025 | I-Connect007
Episode 3 of On the Line With... American Standard Circuits, “How Does Ultra HDI Benefit: Routing Capabilities,” features host Nolan Johnson in conversation with returning guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI technology is transforming design for manufacturability and expanding what’s possible in routing capabilities.

TTM Technologies Expands Ultra Small Radio Frequency Components Offering for Telecom, Test and Measurement, and COTS Mil-Aero Applications

09/22/2025 | Globe Newswire
TTM Technologies, Inc continues to innovate in the field of Radio Frequency & Specialty (RF&S) components with the introduction of new ultra small RF crossover and splitter components. Building on TTM’s commitment to meet the evolving demands within the Telecom, Test and Measurement, and Commercial Off-the-Shelf (COTS) Mil-Aero sectors, these latest offerings further enhance our product lineup.
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