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Inside the New Facility at DIS

10/09/2024 | Marcy LaRont, PCB007 Magazine
DIS has long been known as an equipment builder dedicated to PCB and assembly registration. Amidst a backdrop of increasing sales and expanding product lines, DIS has inaugurated a new facility and doubled its previous footprint. This move was aimed at enhancing operational efficiency and addressing space constraints that had plagued them for years, as well as allowing for the opportunity to expand their technology offering for their customers. In this candid conversation, Tony Faraci, owner and president of DIS, and Jesse Ziomek, DIS global sales director, delve into recent strategic advancements propelling the company forward.

Amkor, TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

10/08/2024 | TSMC
Amkor Technology, Inc. and TSMC announced that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

KLA Completes First Phase of US$200 Million Singapore Operations Expansion

10/04/2024 | KLA
KLA, a world leader in developing industry-leading equipment and services that advance innovation throughout the electronics industry, today celebrated the completion of Phase 1 of its newest manufacturing facility.

Siemens Launches Digital Decarbonization Tool at Climate Week NYC to Help Simplify the Path to Net-Zero Facilities

09/27/2024 | BUSINESS WIRE
Siemens Financial Services launched the Decarbonization Business Optimizer (DBO), a cloud-based tool created to help address the overwhelming complexity of decarbonizing buildings and the financing needed to get to net-zero emissions.

Saab Announces New Munitions Facility in Grayling, Michigan

09/25/2024 | Saab
Saab is moving quickly to increase U.S. munitions production capacity and meet the urgent needs of our customers, building on our decades-long relationship with the U.S. military.
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