-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Pulsonix Version 13 Extends MCAD Integration with the IDX Collaboration Interface
October 11, 2024 | PulsonixEstimated reading time: 2 minutes
Pulsonix, the Electronic Design Automation (EDA) company delivering technology-leading PCB design solutions, today announces the 2024 release of Pulsonix - Version 13.0.
“This tight integration with MCAD using our new IDX collaboration interface means users have a streamlined option with design iteration capabilities,” said Bob Williams, Marketing Director for Pulsonix. “The ECAD/MCAD design process improves significantly, and this results in impressive productivity gains. Pulsonix 13.0 also adds routing, visualisation, and revision control improvements that enhance our feature-rich tools and reflects our dedication to developing products to address the needs of our customers.”
Pulsonix V13.0 benefits from the following new features:
IDX Collaboration
With the introduction of the bi-directional IDX Collaboration interface, MCAD is brought even closer to the PCB designer. IDX enables the delivery of a seamless exchange of data from ECAD to MCAD with the core benefit of incremental design exchange, thus eliminating large design transfers each time a change is made. Changes can be tracked and reviewed with each action accepted or rejected. This means a more efficient and structured approach to designing, all driven from inside the PCB design environment.
Enhanced 3D Engine with Photo-realistic Capabilities
Utilising the powerful Pulsonix 3D engine, a photo-realistic 3D render of the PCB design can be visualised. With the introduction of Ray and Path tracing algorithms, designs can be brought to life. Further enhancements to the 3D engine within Pulsonix 13.0 mean users can now use additional parameters when designing flexi-rigid boards. The definition of neutral axis values more accurately details the plane within the surface of the shape, such that when the material is bent, the plane does not undergo any tension or compression, and so is the 'true' length of the bent shape. This coupled with the display of realistic solder mask layers, transparency and opacity settings provides a higher degree of accuracy for critical designs.
Impedance Controlled Routing
Where the track width is required based on the impedance defined for the net, this is calculated dynamically using this new feature in Pulsonix 13.0 when track editing is initiated. After defining Impedance Rules in the constraint manager, along with the layer material, material thickness and dielectric constant, the calculation is automatically initiated as manual track routing is performed. This reduces design time and improves design accuracy.
Pulsonix Vault
New features in the Pulsonix Vault for Version 13.0 add refinement and greater usability to this option. Vault item permissions and status have been added as well as Find from the Audit trail, the ability to detach MCAD models, a View-only feature, check-in as replacement and a library export by type. The Pulsonix Vault is a free-of charge-option supplied will all Pulsonix variants.
“This significant update delivers a broad range of enhancements and new features throughout the product, enabling engineers to craft designs effortlessly and to streamline their workflows through performance benefits,” added Williams.
Pulsonix Version 13.0 is available now. Learn more about the new features and enhancements, by visiting Pulsonix's website or by visiting us at the PCB Carolina exhibition, November 13 in the McKimmon Center at NC State University, NC, USA, or at Electronica 2024, November 12-15 in Munich, Germany.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.