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HyRel Announces Sale of First Versacell Robotic System to Leading Defense Contractor

12/03/2024 | HyRel
HyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.

iSQUARED Expands Specialized Material Offerings Validated for Stratasys 3D Printers

12/03/2024 | BUSINESS WIRE
iSQUARED, a wholly-owned subsidiary of Stratasys, announced today an expansion of its portfolio of materials validated for use in Stratasys 3D printers, alongside the launch of a marketplace for pre-owned Stratasys machines.

Foxconn Showcases Satellite Technology and Industry Ecosystem at TASTI 2024

12/03/2024 | Foxconn
Hon Hai Technology Group (Foxconn) participated in the 2024 Taiwan Space International Annual Conference (TASTI 2024) being held November 30 - December 4, 2024, showcasing its latest advancements in low-orbit satellite communications and its commitment to building a robust satellite industry ecosystem.

Koh Young Technology Showcasing Advanced Packaging Inspection Solutionsat SEMICON Japan

12/03/2024 | Koh Young Technology
Koh Young Technology, y, the global leader in True 3D measurement-based inspection solutions, will demonstrate its award-winning inspection solutions in Hall 1 Booth 1310 at Tokyo Big Sight on December 12-13, 2024.

ULVAC Launches New Deposition System for Semiconductor Applications

12/02/2024 | JCN Newswire
ULVAC, Inc. has started accepting orders for the ENTRON-EXX, a  new multi-chamber deposition system for semiconductor applications. The ENTRON-EXX builds on the proven productivity and flexibility of its predecessor, the ENTRON-EX W300, while offering enhanced data intelligence and expandability.
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