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Indium to Showcase High-Reliability Solder Technology at IPC APEX EXPO 2025

03/05/2025 | Indium Corporation
Indium Corporation®, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.

Rogers Corporation Launches New Thermoset Laminates for Automotive Radar Sensor Applications

03/03/2025 | Rogers Corporation
Rogers Corporation (NYSE:ROG) announced its latest innovation in dielectric materials: RO4830™ Plus Circuit Materials, which are well suited for cost-sensitive millimeter wave PCB applications, such as 76-81 GHz automotive corner radar sensors.

New Book Explores History of X-ray Technology and Application in Electronics Today

03/05/2025 | I-Connect007
As the field of electronics continues to evolve, X-ray inspection has become an indispensable tool for ensuring quality and reliability in manufacturing processes. In The Printed Circuit Assembler’s Guide to... X-ray Inspection, author Dr. Bill Cardoso, Creative Electron, discusses the development of contemporary X-ray machines, which incorporate advanced imaging, motion, and decision-making steps that facilitate precise defect detection.

AIM to Highlight REL61™, W20, and Ultrafine Paste Offerings at Productronica China

02/19/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Productronica China, taking place March 26-28 at the Shanghai New International Expo Center.

Benchmark Reports Q4, Fiscal Year 2024 Results

02/03/2025 | Benchmark Electronics Inc.
Revenue of $657 million with year-over-year growth in Semi-Cap, A&D and Industrials offset by anticipated weakness in Medical and AC&C.
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