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Sanmina Reports Q4 and Fiscal 2024 Financial Results

11/06/2024 | Sanmina
Sanmina Corporation, a leading integrated manufacturing solutions company, reported financial results for the fourth quarter and fiscal year ended September 28, 2024 and outlook for its fiscal first quarter ending December 28, 2024.

Fabrinet Announces Q1 Fiscal Year 2025 Financial Results

11/06/2024 | Fabrinet
Fabrinet, a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, announced its financial results for its fiscal first quarter ended September 27, 2024.

Incap UK Among the Finalists of the Electronics Industry Awards

11/06/2024 | Incap
Incap Electronics UK was awarded Electronics Manufacturer of the Year at the Electronics Industry Awards 2024. This prestigious British awards competition recognises a manufacturer that has achieved business success in the electronics industry and demonstrated success in collaborations, partnerships, investment, new products and innovations.

Tritek Hosts Open House at Advanced West’s Facility

11/04/2024 | I-Connect007 Editorial Team
In this recent conversation with I-Connect007’s Andy Shaughnessy and Barb Hockaday, Steve Kenney, president of Tritek and Advanced West, discusses their long history serving the PCB industry, dating back to when Tritek sold Shipley chemistry in Southern California. During this interview, recorded minutes before an open house at Advanced West in Corona, California, Steve underscores the company’s customer-centric culture and their drive to meet customers' changing requirements in the PCB space.

Flexible Thinking: Musings on High Density Interconnections

10/30/2024 | Joe Fjelstad -- Column: Flexible Thinking
People have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.
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