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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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TRI to Exhibit Test and Inspection Solutions at SMTA Tijuana Expo
October 21, 2024 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Tijuana Expo & Tech Forum 2024 at the Quartz Hotel Tijuana, Tijuana, Baja California, Mexico on November 7, 2024.
TRI offers Smart Board Testing and Optical Inspection Solutions, which include 3D SPI, 3D AOI, SEMI AOI, 3D CT AXI, SEMI AXI, High-Performance In-Circuit Testing (ICT), and Manufacturing Defects Analyzers (MDA).
TRI’s In-Circuit Testers (ICT) are designed to deliver high performance and reliability while maximizing throughput with features like Parallel Test/Multi-Program capabilities. These modular ICT+FCT solutions offer advanced testing options for high-density pin count boards, making them ideal for multi-industry applications such as data center telecom and automotive.
Main Features::
- User-Friendly Solution: Easy program development and Built-in Self Diagnostics function.
- High-Density Pin Count Board Test: Supports up to 11,088 testing points for high pin-count PCBAs.
- Tests: Boundary Scan, CAN/LIN Bus testing (8 CAN/LIN channels via single USB), LED Analyzer (up to 1080 LED Test Channels), Non-multiplexing 1:1 per pin architecture, Serial Test Controller (STC) Programming, On-board Flash, EEPROM, MAC programming, and more.
Join us at Stand #27 during SMTA Tijuana 2024 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
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Julia McCaffrey - NCAB GroupSuggested Items
Atg Launches Latest Large Format Test System, A9XL, with 8 Heads and 48” x 26” Panel Capability
08/01/2025 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH (a Mycronic company) is proud to roll out a new large format test system generation based on the latest high speed atg A9 (board size up to 24” x 21”) and A9L platform.
Magnalytix’s Dr. Mike Bixenman to Guide PDC at SMTA High-Reliability Cleaning and Conformal Coating Conference
07/31/2025 | MAGNALYTIXMagnalytix, providing real-time reliability solutions for electronics manufacturing, is excited to announce that Dr. Mike Bixenman will present the professional development course “The Effects of Flux Residues and Process Contamination on the Reliability of the Electronic Assembly” on Wednesday, Aug. 13 at 9:00 AM CST to open the second day of the STMA High-Reliability Cleaning and Conformal Coating Conference.
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.