-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
TRI to Exhibit Test and Inspection Solutions at SMTA Tijuana Expo
October 21, 2024 | TRIEstimated reading time: 1 minute

Test Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, will be participating in the SMTA Tijuana Expo & Tech Forum 2024 at the Quartz Hotel Tijuana, Tijuana, Baja California, Mexico on November 7, 2024.
TRI offers Smart Board Testing and Optical Inspection Solutions, which include 3D SPI, 3D AOI, SEMI AOI, 3D CT AXI, SEMI AXI, High-Performance In-Circuit Testing (ICT), and Manufacturing Defects Analyzers (MDA).
TRI’s In-Circuit Testers (ICT) are designed to deliver high performance and reliability while maximizing throughput with features like Parallel Test/Multi-Program capabilities. These modular ICT+FCT solutions offer advanced testing options for high-density pin count boards, making them ideal for multi-industry applications such as data center telecom and automotive.
Main Features::
- User-Friendly Solution: Easy program development and Built-in Self Diagnostics function.
- High-Density Pin Count Board Test: Supports up to 11,088 testing points for high pin-count PCBAs.
- Tests: Boundary Scan, CAN/LIN Bus testing (8 CAN/LIN channels via single USB), LED Analyzer (up to 1080 LED Test Channels), Non-multiplexing 1:1 per pin architecture, Serial Test Controller (STC) Programming, On-board Flash, EEPROM, MAC programming, and more.
Join us at Stand #27 during SMTA Tijuana 2024 to discover why the leading EMS companies choose TRI as their Test and Inspection Partner.
Suggested Items
Discover TRI Test Solutions at New-Tech 2025
05/08/2025 | TRIBynet Testing Systems, TRI's industry partner, will join New-Tech 2025 at EXPO Tel-Aviv, Pavilion 1 from May 20 – 21, 2025.
Datest Expands Presence in the Upper Midwest with Omni-Tec Partnership
05/05/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is proud to announce its partnership with Gary Krieg of Omni-Tec, Inc. as its official sales representative in the Upper Midwest.
Northrop Grumman’s IVEWS Completes F-16 Electronic Warfare Operational Assessment
05/05/2025 | Northrop GrummanNorthrop Grumman Corporation’s IVEWS (Integrated Viper Electronic Warfare Suite) has successfully completed Operational Assessment flight testing on U.S. Air Force F-16 aircraft, demonstrating its effectiveness against advanced radar-guided threats.
Cadence Expands Design IP Portfolio Optimized for Intel 18A and Intel 18A-P Technologies, Advancing AI, HPC and Mobility Applications
05/01/2025 | Cadence Design SystemsCadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK).
The Knowledge Base: Unlocking the Invisible—The Critical Role of X-ray Technology
04/29/2025 | Mike Konrad -- Column: The Knowledge BaseFrom detecting voids under BGAs to solder defects in high-reliability applications, X-ray inspection has become an indispensable tool in modern manufacturing. But how is the technology evolving? What challenges do experts face in deploying X-ray inspection effectively and what does the future hold for this critical quality assurance method?