-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current Issue
The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
TPCA Show 2024 Highlights Taiwan-Thailand Industry-University Collaboration
October 22, 2024 | TPCAEstimated reading time: 2 minutes
With growing investments in Thailand's PCB industry, the 2024 TPCA Show will feature a dynamic "Thailand Theme Zone" to promote collaboration between Taiwanese companies and Thai students. The focus will be on tapping into local market opportunities and nurturing scientific and technological talent, with the ultimate goal of fostering bilateral industry exchanges and cooperation between Taiwan and Thailand.
The TPCA has organized a series of four major industry-university activities under this theme: guided tours, networking events, industry-academia matchmaking, and information sharing. Experts from several leading Thai universities will be present to showcase their technical capabilities, offering attendees a deep dive into Thailand’s academic landscape and exploring potential collaboration opportunities.
Six academic institutions from Thailand are participating in the event, including the National Higher Education, Science, Research and Innovation Policy Office (NXPO), King Mongkut’s University of Technology Thonburi (KMUTT), Prince of Songkla University (PSU), Suranaree University of Technology (SUT), Khon Kaen University (KKU), and Chiang Mai University (CMU). These universities, along with nearly 50 faculty members and students, will engage in a variety of activities during their visit.
The "Guided Tours" on October 22 will take these academic institutions to Xunde Machinery, a high-tech enterprise, and Longhua University of Science and Technology. On the morning of October 24, there will be booth tours with five exhibitors, followed by an afternoon tour for nearly 40 Thai students currently studying in Taiwan, visiting four additional exhibitor booths.
In the "Exchange and Networking" segment, an international luncheon will be held on October 23. TPCA will also host an MOU signing ceremony to formalize Taiwan-Thailand PCB Industry-Academia Cooperation with NXPO, KMUTT, PSU, and SUT. The same day will include the opening ceremony and welcome dinner, providing further opportunities for exhibitors, visitors, and academic participants to connect.
For the "Industry-Academia Matchmaking" activity, a dedicated Thailand-themed zone in Hall L will facilitate employment matchmaking for Thai students and companies. On October 23, professors from the six participating academic institutions will be available for in-depth discussions with exhibitors and human resources teams.
The "Information Sharing" sessions will include presentations on TPCA’s Thailand science and technology talent program, which covers topics like training, employment opportunities, and retention incentives. Starting at 3:00 p.m. on October 23, representatives from each of the six Thai academic institutions will introduce their universities in the Thailand Theme Zone.
These events are designed to strengthen the interactive platform for Taiwan-Thailand industry-university cooperation, drive innovation in the circuit board industry, and support the retention of talent through TPCA’s training programs. The collaboration showcases the shared commitment of Taiwan and Thailand to cultivate technological talent and drive mutual growth in the PCB industry through industry-university partnerships.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
11/05/2025 | MycronicMycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.